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LP87702 датащи(PDF) 78 Page - Texas Instruments |
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LP87702 датащи(HTML) 78 Page - Texas Instruments |
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78 / 98 page ![]() 8 Application and Implementation Note Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality. 8.1 Application Information The LP87702 is a power-management unit including a boost converter, two step-down converters, and three general-purpose digital output signals. 8.2 Typical Application SW_B0 VIN_B0 VIN_B1 VANA VIN FB_B0 VOUT0 LOAD SDA (EN3) SCL (EN2) nINT CLKIN (GPO2) GNDs EN1 SW_B1 FB_B1 VOUT1 PG0 VMON1 VMON2 PG1 (GPO1) WDI WD_RESET SW_BST VOUT_BST VOUT2 LOAD LOAD GPO0 NRST Copyright © 2017, Texas Instruments Incorporated L0 L1 COUT0 COUT1 COUT2 CIN0 CIN1 CANA L2 Figure 8-1. LP87702 Typical Application 8.2.1 Design Requirements Table 8-1. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Input voltage 3.3 V Output voltages 1.8 V, 1.24 V, 5 V Switching frequency 4 MHz 8.2.2 Detailed Design Procedure The performance of the LP87702 device depends greatly on the care taken in designing the printed circuit board (PCB). The use of low-inductance and low serial-resistance ceramic capacitors is strongly recommended, while proper grounding is crucial. Attention should be given to decoupling the power supplies. Decoupling capacitors must be connected close to the device and between the power and ground pins to support high peak currents being drawn from the system power rail while turning on the switching MOSFETs. Keep input and output traces as short as possible, because trace inductance, resistance, and capacitance can easily become the performance limiting items. The separate buck converter power pins VIN_Bx are not connected together internally. The VIN_Bx power connections shall be connected together outside the package using a power plane construction. LP87702 SNVSBU3 – MARCH 2021 www.ti.com 78 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LP87702 |
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