ADC3683 datasheet(5/70 Pages) TI1

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5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

PARAMETER

TEST CONDITIONS

MIN

MAX

UNIT

Supply voltage range, AVDD, IOVDD

–0.3

2.1

Supply voltage range, GND, IOGND, REFGND

–0.3

0.3

Voltage applied to

input pins

AINP/M, BINP/M, CLKP/M, VREF, REFBUF

–0.3

MIN(2.1, AVDD+0.3)

PDN/SYNC, RESET, SCLK, SEN, SDIO

–0.3

MIN(2.1, AVDD+0.3)

DCLKINP/M

–0.3

MIN(2.1, IOVDD+0.3)

Junction temperature, TJ

125

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

1000

Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)

250

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply

voltage range

AVDD(1)

1.75

1.8

1.85

IOVDD(1)

1.75

1.8

1.85

Operating free-air temperature

–55

105

°C

Operating junction temperature

105(2)

°C

(1)

Measured to GND.

(2)

Prolonged use above this junction temperature may increase the device failure-in-time (FIT) rate.

5.4 Thermal Information

THERMAL METRIC(1)

ADC3683-SP

UNIT

HBP (CFP)

64 Pins

RΘJA

Junction-to-ambient thermal resistance

28.4

°C/W

RΘJC(top)

Junction-to-case (top) thermal resistance

12.0

°C/W

RΘJB

Junction-to-board thermal resistance

14.1

°C/W

ΨJT

Junction-to-top characterization parameter

7.8

°C/W

ΨJB

Junction-to-board characterization parameter

13.8

°C/W

RΘJC(bot)

Junction-to-case (bottom) thermal resistance

7.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

www.ti.com

ADC3683-SP

SBASAB5 – MARCH 2024

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