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AD9523-1/PCBZ датащи(PDF) 12 Page - Analog Devices |
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AD9523-1/PCBZ датащи(HTML) 12 Page - Analog Devices |
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12 / 60 page ![]() AD9523-1 Rev. B | Page 12 of 60 ABSOLUTE MAXIMUM RATINGS Table 16. Parameter Rating VDD3_PLL, VDD3_REF, VDD3_OUT[x:y], LDO_VCO to GND −0.3 V to +3.6 V REFA, REFA, REFB, REFB to GND −0.3 V to +3.6 V SCLK/SCL, SDIO/SDA, SDO, CS to GND −0.3 V to +3.6 V OUT0, OUT0, OUT1, OUT1, OUT2, OUT2, OUT3, OUT3, OUT4, OUT4, OUT5, OUT5, OUT6, OUT6, OUT7, OUT7, OUT8, OUT8, OUT9, OUT9, OUT10, OUT10, OUT11, OUT11, OUT12, OUT12, OUT13, OUT13 to GND −0.3 V to +3.6 V SYNC, RESET, PD, REF_SEL to GND −0.3 V to +3.6 V STATUS0, STATUS1 to GND −0.3 V to +3.6 V SP0, SP1, EEPROM_SEL to GND −0.3 V to +3.6 V VDD1.8_OUT[x:y], LDO_PLL1, LDO_DIV_M1 to GND 2 V Junction Temperature1 115°C Storage Temperature Range −65°C to +150°C Lead Temperature (10 sec) 300°C 1 See Table 17 for θJA. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 17. Thermal Resistance Package Type Airflow Velocity (m/sec) θJA1, 2 θJC1, 3 θJB1, 4 Ψ JT 1, 2 Unit 0 21.3 1.7 12.6 0.1 °C/W 1.0 20.1 0.2 °C/W 72-Lead LFCSP, 10 mm × 10 mm 2.5 18.1 0.3 °C/W 1 Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board. 2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). 3 Per MIL-Std 883, Method 1012.1. 4 Per JEDEC JESD51-8 (still air). Additional power dissipation information can be found in the Power Dissipation and Thermal Considerations section. ESD CAUTION |
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