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IMX35 датащи(PDF) 20 Page - Freescale Semiconductor, Inc

номер детали IMX35
подробное описание детали  i.MX35 Applications Processors for Industrial and Consumer Products
PDF  148 Pages
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производитель  FREESCALE [Freescale Semiconductor, Inc]
домашняя страница  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

IMX35 датащи(HTML) 20 Page - Freescale Semiconductor, Inc

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i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 6
Freescale Semiconductor
20
4.7
I/O Pin DC Electrical Characteristics
I/O pins are of two types: GPIO and DDR. DDR pins can be configured in three different drive strength
modes: mobile DDR, SDRAM, and DDR2. The SDRAM and mobile DDR modes can be further
customized at three drive strength levels: normal, high, and max.
Table 12 shows currents for the different DDR pin drive strength modes.
Junction to case (top)3
—ReJCtop
10
ºC/W
Junction to package top4
Natural convection
ΨJT
2ºC/W
1 Junction-to-ambient thermal resistance determined per JEDC JESD51-3 and JESD51-6. Thermal test board meets JEDEC
specification for this package.
2 Junction-to-board thermal resistance determined per JEDC JESD51-8. Thermal test board meets JEDEC specification for this
package.
3 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is used
for the case temperature. Reported value includes the thermal resistance of the interface layer.
4 Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, this thermal characterization parameter is written
as Psi-JT.
Table 12. DDR Pin Drive Strength Mode Current Levels
Drive Mode
Normal
High
Max.
Mobile DDR (1.8 V)
3.6 mA
7.2 mA
10.8 mA
SDRAM (1.8 V)
6.5 mA
SDRAM (3.3 V)
4 mA
8 mA
12 mA
DDR2 (1.8 V)
13.4 mA
Table 11. Thermal Resistance Data (continued)
Rating
Condition
Symbol
Value
Unit



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