IMX35 datasheet(18/148 Pages) FREESCALE

18 / 148 page

i.MX35 Applications Processors for Industrial and Consumer Products, Rev. 6

Freescale Semiconductor

requirements will be satisfied during startup and transient conditions. Freescale recommends that system

current measurements be taken with customer-specific use-cases to reflect normal operating conditions in

the end system.

The method for obtaining max current is as follows:

1. Measure worst case power consumption on individual rails using directed test on i.MX35.

2. Correlate worst case power consumption power measurements with worst case power

consumption simulations.

3. Combine common voltage rails based on power supply sequencing requirements

4. Guard band worst case numbers for temperature and process variation. Guard band is based on

process data and correlated with actual data measured on i.MX35.

5. The sum of individual rails is greater than real world power consumption, as a real system does

not typically maximize power consumption on all peripherals simultaneously.

4.6

Thermal Characteristics

The thermal resistance characteristics for the device are given in Table 11. These values were measured

under the following conditions:

•

Two-layer substrate

•

Substrate solder mask thickness: 0.025 mm

•

Substrate metal thicknesses: 0.016 mm

•

Substrate core thickness: 0.200 mm

•

Core via I.D: 0.168 mm, Core via plating 0.016 mm.

•

Full array map design, but nearly all balls under die are power or ground.

•

Die Attach: 0.033 mm non-conductive die attach, k = 0.3 W/m K

•

Mold compound: k = 0.9 W/m K

Table 10. Power Consumption

Power Supply

Voltage (V)

Max Current (mA)

QVCC

1.47

400

MVDD, PVDD

1.65

NVCC_EMI1, NVCC_EMI2, NVCC_EMI3, NVCC_LCDC, NVCC_NFC

1.9

FUSE_VDD (This rail is typically tied to ground; it only needs a voltage if system

fuse burning is needed)

3.6

NVCC_MISC, NVCC_CSI, NVCC_SDIO, NVCC_CRM, NVCC_ATA, NVCC_MLB,

NVCC_JTAG

3.6

OSC24M_VDD, OSC_AUDIO_VDD, PHY1_VDDA, PHY2_VDD,

USBPHY1_UPLLVDD, USBPHY1_VDDA_BIAS

3.6

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