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LPC2921 датащи(PDF) 70 Page - NXP Semiconductors |
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LPC2921 датащи(HTML) 70 Page - NXP Semiconductors |
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70 / 83 page ![]() LPC2921_23_25_1 © NXP B.V. 2009. All rights reserved. Preliminary data sheet Rev. 01 — 15 June 2009 70 of 83 NXP Semiconductors LPC2921/2923/2925 ARM9 microcontroller with CAN, LIN, and USB 9.6 Dynamic characteristics: ADC1/2 [1] All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at Tamb =85 °C ambient temperature on wafer level. Cased products are tested at Tamb =25 °C (final testing). Both pre-testing and final testing use correlated test conditions to cover the specified temperature and power supply voltage range. [2] Duty cycle clock should be as close as possible to 50 %. 10. Application information 10.1 Operating frequency selection The LPC2921/2923/2925 is specified to operate at a maximum frequency of 125 MHz, maximum temperature of 85 °C, and maximum core voltage of 1.89 V. Figure 25 and Figure 26 show that the user can achieve higher operating frequencies for the LPC2921/2923/2925 by controlling the temperature and the core voltage accordingly. Table 39. ADC dynamic characteristics VDD(CORE) =VDD(OSC_PLL); VDD(IO) = 2.7 V to 3.6 V; VDDA(ADC3V3) = 3.0 V to 3.6 V; all voltages are measured with respect to ground.[1] Symbol Parameter Conditions Min Typ Max Unit fi(ADC) ADC input frequency [2] 4 - 4.5 MHz fs(max) maximum sampling rate fi(ADC) = 4.5 MHz; fs =fi(ADC)/(n + 1) with n = resolution resolution 2 bit - - 1500 ksample/s resolution 10 bit - - 400 ksample/s tconv conversion time In number of ADC clock cycles 3 - 11 cycles In number of bits 2 - 10 bits Fig 25. Core operating frequency versus temperature for different core voltages temperature ( °C) 25 85 65 45 002aae194 125 115 135 145 core frequency (MHz) 105 VDD(CORE) = 1.95 V VDD(CORE) = 1.8 V VDD(CORE) = 1.65 V |
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