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LPC2921 датащи(PDF) 68 Page - NXP Semiconductors

номер детали LPC2921
подробное описание детали  ARM9 microcontroller with CAN, LIN, and USB
PDF  83 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

LPC2921 датащи(HTML) 68 Page - NXP Semiconductors

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LPC2921_23_25_1
© NXP B.V. 2009. All rights reserved.
Preliminary data sheet
Rev. 01 — 15 June 2009
68 of 83
NXP Semiconductors
LPC2921/2923/2925
ARM9 microcontroller with CAN, LIN, and USB
9.4 Dynamic characteristics: SPI
[1]
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at Tamb =85 °C ambient
temperature on wafer level. Cased products are tested at Tamb =25 °C (final testing). Both pre-testing and final testing use correlated
test conditions to cover the specified temperature and power supply voltage range.
Table 36.
Dynamic characteristics of SPI pins
VDD(CORE) =VDD(OSC_PLL) ; VDD(IO) = 2.7 V to 3.6 V; VDDA(ADC3V3) = 3.0 V to 3.6 V; Tvj = −40 °Cto+85 °C; all voltages are
measured with respect to ground; positive currents flow into the IC; unless otherwise specified.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fSPI
SPI operating frequency
master operation
1
⁄
65024fclk(SPI)
-
1
⁄
2fclk(SPI) MHz
slave operation
1
⁄
65024fclk(SPI)
-
1
⁄
4fclk(SPI) MHz
tsu(SPI_MISO)
SPI_MISO set-up time
Tamb = 25 °C;
measured in
SPI Master
mode; see
Figure 24
-11
-
ns
Fig 24. SPI data input set-up time in SSP Master mode
tsu(SPI_MISO)
SCKn
shifting edges
SDOn
SDIn
002aae695
sampling edges



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