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LXT971ABC датащи(PDF) 88 Page - Intel Corporation |
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LXT971ABC датащи(HTML) 88 Page - Intel Corporation |
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88 / 90 page ![]() LXT971A 3.3V Dual-Speed Fast Ethernet Transceiver 88 Datasheet Document #: 249414 Revision #: 002 Rev. Date: August 7, 2002 7.0 Package Specifications Figure 43. PBGA Package Specification 1.26 ± 0.10 0.70 ± 0.025 0.26 ± 0.04 0.28 ± 0.10 3 SEATING PLANE SIDE VIEW TOP VIEW BOTTOM VIEW OPTION: PIN A1 IDENTIFIER 1.00 ± 0.10 INK OR LASER MARKING C 7.00 ± 0.20 B 2.00 REF. 0.20 (4X) NOTES: 1. All dimensions and tolerances conform to ASME Y 14.5 M - 1994. 2. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C. 3. Primary datum C and seating plane are defined by the spherical crowns of the solder balls. 4. Maximum mold to substrate offset shall be 0.127. 5. The surface finish of the package shall be EDM Charmille #18 - #21. 6. Unless otherwise specified tolerance: Decimal ± 0.05 Angular ±2°. B H G F E D C A 87 6 5 43 2 1 2 0.70 REF. 6.30 0.80 0.40 ± 0.15 0.30 0.15 C C B A 64-Ball Plastic Ball Grid Array Package • Part Number - LXT971ABC Commercial Temperature Range (0ºC to +70ºC) • Part Number - LXT971ABE Extended Temperature Range (-40ºC to +85ºC) |
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