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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32WB50CG датащи(PDF) 111 Page - STMicroelectronics |
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STM32WB50CG датащи(HTML) 111 Page - STMicroelectronics |
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111 / 119 page  DS13047 Rev 5 111/119 STM32WB50CG STM32WB30CE Package information 115 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 7.1 UFQFPN48 package information UFQFPN48 is a 7 x 7mm, 0.5 mm pitch, ultra thin fine pitch quad flat package. Figure 27. UFQFPN48 outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. A0B9_ME_V3 D Pin 1 identifier laser marking area EE D Y D2 E2 Exposed pad area Z 1 48 Detail Z R 0.125 typ. 1 48 L C 0.500x45° pin1 corner A Seating plane A1 b e ddd Detail Y T |
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