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PC8374L датащи(PDF) 34 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
номер детали PC8374L
подробное описание детали  SensorPathTM SuperI/O with Glue Functions
PDF  239 Pages
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производитель  NSC [National Semiconductor (TI)]
домашняя страница  http://www.national.com
Logo NSC - National Semiconductor (TI)

PC8374L датащи(HTML) 34 Page - National Semiconductor (TI)

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2.0 Power, Reset and Clocks (Continued)
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34
Revision1.1
Ground Connection. The following items must be connected to the ground layer (VSS) as close to the device as possible:
• The ground return (V
SS) pins
• The decoupling capacitors of the Main power supply (V
DD3) pins
• The decoupling capacitors of the Standby power supply (V
SB3) pins
• The decoupling capacitor of the Standby 5V supply (V
SB5) pin
• The decoupling capacitor of the on-chip Core power converter (V
CORF) pin
• The decoupling capacitor of the Backup battery (V
BAT) pin
Note that a low-impedance ground layer also improves noise isolation.
Decoupling Capacitors. The following decoupling capacitors must be used in order to reduce EMI and ground bounce:
• Main power supply (V
DD3): Place one capacitor of 0.1 µF on each VDD3-VSS pin pair as close to the pin as possible. In
addition, place one 10
−47 µF tantalum capacitor on the common net as close to the chip as possible.
• Standby power supply (V
SB3): Place one capacitor of 0.1 µF on each VSB3-VSS pin pair as close to the pin as possible.
In addition, place one 10
−47 µF tantalum capacitor on the common net as close to the chip as possible.
• Standby 5V supply (V
SB5): Place one capacitor of 0.1 µF on the VSB5-VSS pin pair as close to the pin as possible.
• On-chip Core power converter (V
CORF): Place one 1 µF ceramic capacitor on the VCORF-VSS pin pair as close to the pin
as possible.
• Backup battery (V
BAT): Place one capacitor of 0.1 µF on the VBAT pin as close to the pin as possible.
Figure 2. Decoupling Capacitors Connection
2.2 RESET SOURCES AND TYPES
The PC8374L device has five reset sources:
• V
BAT Power-Up Reset - activated when VBAT is powered up, if VSB3 is off.
• V
SB Power-Up Reset - activated when VSB3 is powered up.
• V
DD Power-Up Reset - activated when VDD3 is powered up.
• Hardware Reset - activated when the PCI_RESET input is asserted (low).
• Software Reset - triggered by SWRST bit in SIOCF1 register (see Section 3.7.5 on page 54); SWRST bit is set by the
host through the LPC interface.
VDD3
0.1
µF
8
6
0.1
µF
29
31
0.1
µF
46
49
0.1
µF
58
60
VSS
VDD3
VDD3
VDD3
VSS
VSS
VSS
+
10-47
µF
Main 3.3V
VSB3
VSS
VSB3
VSB3
VSS
VSS
0.1
µF
78
76
0.1
µF
96
93
0.1
µF
110
107
+
10-47
µF
Standby 3.3V
1
µF
97
VCORF
VSB5
0.1
µF
71
Standby 5V
Backup
0.1
µF
98
VBAT
Battery
PC8374L
Winbond Electronics Corp. Advanced PC Product Center



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