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PC8374L датащи(PDF) 28 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
номер детали PC8374L
подробное описание детали  SensorPathTM SuperI/O with Glue Functions
PDF  239 Pages
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производитель  NSC [National Semiconductor (TI)]
домашняя страница  http://www.national.com
Logo NSC - National Semiconductor (TI)

PC8374L датащи(HTML) 28 Page - National Semiconductor (TI)

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1.0 Signal/Pin Connection and Description (Continued)
www.national.com
28
Revision1.1
1.4.12 Configuration Straps and Testing
1.4.13 Power and Ground
Signal
Pin(s)
I/O Buffer Type Power Well
Description
BADDR
30
I
INTS
VDD3
Base Address. Sampled at VDD Power-Up reset to determine
the base address of the configuration Index-Data register pair,
as follows:
– No pull-down resistor (default)
- 2Eh-2Fh
–10K
Ω1 external pull-down resistor - 4Eh-4Fh
The external pull-down resistor must be connected to VSS.
1. Because the strap function is multiplexed with the Serial Port pins, a CMOS transceiver device is recommended
for Serial Port functionality; in this case, the value of the external pull-down resistor is 10 K
Ω. If, however, a TTL
transceiver device is used, the value of the external pull-down resistor must be 470
Ω, and since the Serial Port
pins are not able to drive this load, the external pull-down resistor must be disconnected tEPLV after VDD3
power-up (see “VDD Power-Up Reset” on page 221).
VsbStrap1
117
I
INTS
VSB3
Vsb Strap 1. Reserved strap input function for National use.
VddStrap1
122
I
INTS
VDD3
Vdd Strap 1. Reserved strap input function for National use.
VddStrap2
125
I
INTS
VDD3
Vdd Strap 2. General-Purpose strap input function.
TRIS
26
I
INTS
VDD3
TRI-STATE Device. Sampled at VDD Power-Up reset to force
the device to float all its output and I/O pins, as follows:
– No pull-down resistor (default)
- normal pin operation
–10K
Ω1 external pull-down resistor - floating device pins
The external pull-down resistor must be connected to VSS.
When TRIS is set to 0 (by an external pull-down resistor), TEST
must be 1 (left unconnected).
TEST
27
I
INTS
VDD3
XOR Tree Test Mode. Sampled at VDD Power-Up reset to force
the device pins into a XOR tree configuration, as follows:
– No pull-down resistor (default)
- normal device operation
–10K
Ω1 external pull-down resistor - pins configured as XOR
tree.
When TEST is set to 0 (by an external pull-down resistor), TRIS
must be 1 (left unconnected).
XOR_OUT
30
O
O4/8
VDD3
XOR Tree Output. All the device pins (except not connected pins,
power type and analog type pins) are internally connected in a
XOR tree structure.
Signal
Pin(s)
I/O Buffer Type
Power
Well
Description
VSS
8, 29, 46, 58,
78, 96, 110
I
GND
Ground. Ground connection for both core logic and I/O buffers,
for the Main, Standby and Battery power supplies.
VDD3
6, 31, 49, 60
I
PWR
Main 3.3V Power Supply. Powers the I/O buffers of the legacy
peripherals and the LPC interface.
VSB3
76, 93, 107
I
PWR
Standby 3.3V Power Supply. Powers the I/O buffers of the
GPIO ports, SWC, Glue Functions, Health Management and the
on-chip Core power converter.
VCORF
97
I/O
PWR
On-Chip Core Power Converter Filter. On-chip Core power
converter output. An external 1
µF ceramic filter capacitor must
be connected between this pin and VSS.
Winbond Electronics Corp. Advanced PC Product Center



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