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PC87413 датащи(PDF) 238 Page - National Semiconductor (TI) |
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PC87413 датащи(HTML) 238 Page - National Semiconductor (TI) |
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238 / 257 page ![]() 11.0 Device Characteristics (Continued) www.national.com 238 Revision1.2 11.5 AC ELECTRICAL CHARACTERISTICS 11.5.1 AC Test Conditions Figure 56. AC Test Conditions, TA =0 °Cto70 °C, VSUP = 3.3V ±10% Notes: 1. VSUP is VDD, VSB or VPP according to the pin power well. 2. CL = 50 pF for all output pins except the following pin groups: CL = 100 pF for Serial Port 1 and 2 (see Section 1.4.4 on page 24), Parallel Port (see Section 1.4.5) and Floppy Disk Controller (see Section 1.4.6) pins; CL = 40 pF for HFCKOUT pin; CL = 400 pF for ACCESS.bus pins (see Section 1.4.2 on page 23); These values include both jig and oscilloscope capacitance. 3. S1 = Open for push-pull output pins. S1 = VSUP for high impedance to active low and active low to high impedance transition measurements. S1 = GND for high impedance to active high and active high to high impedance transition measurements. RL = 1.0 KΩ for all the pins. 4. For the FDC open-drain interface pins, S1 = VDD and RL = 150 Ω. Device Under Test 0.1 µf Input Output RL CL S1 Load Circuit AC Testing Input, Output Waveform VSUP 2.4 0.4 2.0 0.8 Test Points 2.0 0.8 |
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