MPC8569E datasheet(121/127 Pages) FREESCALE

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Thermal Management Information

MPC8569E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1

Freescale Semiconductor

121

The following figure depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit

board.

Figure 74. Package with Heat Sink Mounted to a Printed-Circuit Board

The heat sink removes most of the heat from the device. Heat generated on the active side of the chip is conducted through the

silicon and the heat sink attach material (or thermal interface material), and to the heat sink. The junction-to-case thermal

resistance is low enough that the heat sink attach material and heat sink thermal resistance are the dominant terms.

3.3.2

Thermal Interface Materials

A thermal interface material is required at the package-to-heat sink interface to minimize the thermal contact resistance. The

performance of thermal interface materials improves with increased contact pressure; this performance characteristic chart is

generally provided by the thermal interface vendor. The recommended method of mounting heat sinks on the package is by

means of a spring clip attachment to the printed-circuit board (see Figure 73).

The system board designer can choose among several types of commercially-available thermal interface materials.

3.3.3

Temperature Diode

The device has a temperature diode on the microprocessor that can be used in conjunction with other system temperature

monitoring devices (such as On Semiconductor, NCT1008™). These devices use the negative temperature coefficient of a diode

operated at a constant current to determine the temperature of the microprocessor and its environment.

The following are the specifications of the MPC8569E on-board temperature diode:

Operating range: 10 – 230

μA

Ideality factor over 13.5 – 220

μA; n = 1.006 +/- 0.008

Package Description

The following section describes the detailed content and mechanical description of the package.

External Resistance

Internal Resistance

Radiation

Convection

Radiation

Convection

Heat Sink

Printed-Circuit Board

Thermal Interface Material

Package/Leads

Die Junction

Die/Package

(Note the internal versus external package resistance.)

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