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MPC8569E датащи(PDF) 42 Page - Freescale Semiconductor, Inc |
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MPC8569E датащи(HTML) 42 Page - Freescale Semiconductor, Inc |
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42 / 127 page ![]() MPC8569E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1 Power Characteristics Freescale Semiconductor 42 2.1.4 Power-on Ramp Rate This section describes the AC electrical specifications for the power-on ramp rate requirements. Controlling the maximum Power-On Ramp Rate is required to avoid falsely triggering the ESD circuitry. The following table provides the power supply ramp rate specifications. 2.2 Power Characteristics The following table shows the power dissipations of the VDD supply for various operating core complex bus clock (CCB_clk) frequencies versus the core, DDR data rate, and QUICC Engine block frequencies. Note that these numbers are based on design estimates only and are preliminary. More accurate power numbers are available after the measurement on the silicon is complete. Table 7. Power Supply Ramp Rate Parameter Min Max Unit Notes Required ramp rate for all voltage supplies (including OVDD/CVDD/ GVDD/BVDD/SVDD/LVDD, All VDD supplies, MVREF and all AVDD sup- plies.) — 36000 V/s 1, 2 Note: 1. Ramp rate is specified as a linear ramp from 10 to 90%. If non-linear (for example, exponential), the maximum rate of change from 200 to 500 mV is the most critical as this range may falsely trigger the ESD circuitry. 2. Over full recommended operating temperature range (see Table 3). Table 8. MPC8569E Power Dissipation Power Mode Core Frequency (MHz) Platform Frequency (MHz) DDR Data Rate Frequency (MHz) QUICC Engine Block Frequency (MHz) VDD Core (V) Junction Temperature ( °C) Power5 Notes Typical 800 400 600 400 1.0 65 3.4 W 1, 2 Thermal 105 4.9 W 1, 3 Maximum 5.4 W 1, 4 Typical 1067 533 667 533 1.0 65 3.9 W 1, 2 Thermal 105 5.4 W 1, 3 Maximum 6.0 W 1, 4 |
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