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ECP2 датащи(PDF) 89 Page - Lattice Semiconductor |
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ECP2 датащи(HTML) 89 Page - Lattice Semiconductor |
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89 / 386 page ![]() 3-37 DC and Switching Characteristics Lattice Semiconductor LatticeECP2/M Family Data Sheet DLL Timing Over Recommended Operating Conditions Parameter Description Min. Typ. Max. Units fREF Input reference clock frequency (on-chip or off-chip) 100 — 500 MHz fFB Feedback clock frequency (on-chip or off-chip) 100 — 500 MHz fCLKOP 1 Output clock frequency, CLKOP 100 — 500 MHz fCLKOS 2 Output clock frequency, CLKOS 25 — 500 MHz tPJIT Output clock period jitter (clean input) — 250 ps p-p tCYJIT Output clock cycle to cycle jitter (clean input) 250 ps p-p tDUTY Output clock duty cycle (at 50% levels, 50% duty cycle input clock, 50% duty cycle circuit turned off, time reference delay mode) 35 65 % tDUTYTRD Output clock duty cycle (at 50% levels, arbitrary duty cycle input clock, 50% duty cycle circuit enabled, time reference delay mode) 40 60 % tDUTYCIR Output clock duty cycle (at 50% levels, arbitrary duty cycle input clock, 50% duty cycle circuit enabled, clock injection removal mode) 40 60 % tSKEW 3 Output clock to clock skew between two outputs with the same phase setting — — 100 ps tPWH Input clock minimum pulse width high (at 80% level) 750 — — ps tPWL Input clock minimum pulse width low (at 20% level) 750 — — ps tR, tF Input clock rise and fall time (20% to 80% levels) — — 1 ns tINSTB Input clock period jitter — — +/-250 ps tLOCK DLL lock time 18,500 — — cycles tRSWD Digital reset minimum pulse width (at 80% level) 3 — — ns tPA Delay step size 16.5 42 59.4 ps tRANGE1 Max. delay setting for single delay block (144 taps) 2.376 6 8.553 ns tRANGE4 Max. delay setting for four chained delay blocks 9.504 24 34.214 ns 1. CLKOP runs at the same frequency as the input clock. 2. CLKOS minimum frequency is obtained with divide by 4. 3. This is intended to be a “path-matching” design guideline and is not a measurable specification. Timing v.A 0.11 |
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