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ECP2 датащи(PDF) 45 Page - Lattice Semiconductor |
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ECP2 датащи(HTML) 45 Page - Lattice Semiconductor |
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45 / 386 page ![]() 2-42 Architecture Lattice Semiconductor LatticeECP2/M Family Data Sheet Figure 2-38. LatticeECP2M Banks LatticeECP2/M devices contain two types of sysI/O buffer pairs. 1. Top (Bank 0 and Bank 1) sysI/O Buffer Pairs (Single-Ended Outputs Only) The sysI/O buffer pairs in the top banks of the device consist of two single-ended output drivers and two sets of single-ended input buffers (both ratioed and referenced). One of the referenced input buffers can also be con- figured as a differential input. The two pads in the pair are described as “true” and “comp”, where the true pad is associated with the positive side of the differential input buffer and the comp (complementary) pad is associated with the negative side of the differential input buffer. 2. Bottom (Bank 4 and Bank 5) sysI/O Buffer Pairs (Single-Ended Outputs Only) The sysI/O buffer pairs in the bottom banks of the device consist of two single-ended output drivers and two V REF1(7) GND V CCIO7 V REF2(7) V REF1(6) GND V CCIO6 V REF2(6) VREF1(2) GND V CCIO2 V REF2(2) VREF1(3) GND V CCIO3 V REF2(3) GND VCCIO8 Bank 5 Bank 4 Bank 0 Bank 1 BOTTOM SERDES Quad SERDES Quad SERDES Quad SERDES Quad TOP |
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