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MPC8313E датащи(PDF) 12 Page - Freescale Semiconductor, Inc |
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MPC8313E датащи(HTML) 12 Page - Freescale Semiconductor, Inc |
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12 / 92 page ![]() MPC8313E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 1 12 Freescale Semiconductor Clock Input Timing Table 6 shows the estimated core power dissipation of the MPC8313E while transitioning into the D3warm low power state. 4 Clock Input Timing This section provides the clock input DC and AC electrical characteristics for the MPC8313E. 4.1 DC Electrical Characteristics Table 7 provides the system clock input (SYS_CLK_IN/PCI_SYNC_IN) DC timing specifications for the MPC8313E. 4.2 AC Electrical Characteristics The primary clock source for the MPC8313E can be one of two inputs, SYS_CLK_IN or PCI_CLK, depending on whether the device is configured in PCI host or PCI agent mode. Table 8 provides the system clock input (SYS_CLK_IN/PCI_CLK) AC timing specifications for the MPC8313E. Table 6. MPC8313E Low Power Modes Power Dissipation 1, 1 All interfaces are enabled. For further power savings, disable the clocks to unused blocks. 333-MHz core, 167-MHz CSB 2 2 The interfaces are run at the following frequencies: DDR: 167 MHz, eLBC 167 MHz, PCI 33 MHz, eTSEC1 and 2: 167 MHz, SEC: 167 MHz, USB: 167 MHz. See the SCCR register for more information. Maximum 3 3 Maximum power is based on a voltage of 1.05 V and a junction temperature of 105° C. Unit D3 warm 400 mW Table 7. SYS_CLK_IN DC Electrical Characteristics Parameter Condition Symbol Min Max Unit Input high voltage — VIH 2.7 NVDD +0.3 V Input low voltage — VIL –0.3 0.4 V SYS_CLK_IN Input current 0 V ≤ VIN ≤ NVDD IIN —±10 μA PCI_SYNC_IN Input current 0 V ≤ VIN ≤ 0.5 V or NVDD – 0.5 V ≤ VIN ≤ NVDD IIN —±10 μA PCI_SYNC_IN Input current 0.5 V ≤ VIN ≤ NVDD – 0.5 V IIN —±50 μA Table 8. SYS_CLK_IN AC Timing Specifications Parameter/Condition Symbol Min Typical Max Unit Notes SYS_CLK_IN/PCI_CLK frequency fSYS_CLK_IN 24 — 66.67 MHz 1 SYS_CLK_IN/PCI_CLK cycle time tSYS_CLK_IN 15 — — ns — |
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