STM32H533CE datasheet(128/231 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32H533xx

128/231

DS14539 Rev 1

As a consequence, it is recommended to add a serial resistor (1 kΩ), located as close as

possible to the MCU, to the pins exposed to noise (connected to tracks longer than 50 mm

on PCB).

Designing hardened software to avoid noise problems

EMC characterization and optimization are performed at component level with a typical

application environment and simplified MCU software. It should be noted that good EMC

performance is highly dependent on the user application and the software in particular.

Therefore it is recommended that the user applies EMC software optimization and

prequalification tests in relation with the EMC level requested for his application.

Software recommendations

The software flowchart must include the management of runaway conditions such as:

•

Corrupted program counter

•

Unexpected reset

•

Critical data corruption (such as control registers)

Prequalification trials

Most of the common failures (unexpected reset and program counter corruption) can be

reproduced by manually forcing a low state on the NRST or on the oscillator pins for 1 s.

To complete these trials, ESD stress can be applied directly on the device, over the range of

specification values. When unexpected behavior is detected, the software can be hardened

to prevent unrecoverable errors occurring (see application note AN1015 “Software

techniques for improving microcontrollers EMC performance”).

Electromagnetic Interference (EMI)

The electromagnetic field emitted by the device is monitored while a simple application,

executing EEMBC code, is running. This emission test is compliant with SAE IEC61967-2

standard, which specifies the test board and the pin loading.

Table 52. EMS characteristics

Symbol

Parameter

Conditions

Level/Class

VFESD

Voltage limits to apply on any I/O pin to

induce a functional disturbance

VDD = 3.3 V, TA = 25 °C,

LQFP144, frcc_cpu_ck = 250 MHz,

conform to IEC 61000-4-2

VFTB

Fast transient voltage burst limits to apply

through 100 pF on VDD and VSS pins to

induce a functional disturbance

VDD = 3.3 V, TA = 25 °C,

LQFP144, frcc_cpu_ck = 250 MHz,

conform to IEC 61000-4-4

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