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PIC16F684 датащи(PDF) 139 Page - Microchip Technology

номер детали PIC16F684
подробное описание детали  14-Pin, Flash-Based 8-Bit CMOS Microcontrollers with nanoWatt Technology
PDF  192 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

PIC16F684 датащи(HTML) 139 Page - Microchip Technology

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© 2007 Microchip Technology Inc.
DS41202F-page 137
PIC16F684
15.6
Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C
≤ TA ≤ +125°C
Param
No.
Sym
Characteristic
Typ
Units
Conditions
TH01
θJA
Thermal Resistance
Junction to Ambient
69.8
C/W
14-pin PDIP package
85.0
C/W
14-pin SOIC package
100.4
C/W
14-pin TSSOP package
46.3
C/W
16-pin QFN 4x0.9mm package
TH02
θJC
Thermal Resistance
Junction to Case
32.5
C/W
14-pin PDIP package
31.0
C/W
14-pin SOIC package
31.7
C/W
14-pin TSSOP package
2.6
C/W
16-pin QFN 4x0.9mm package
TH03
TJ
Junction Temperature
150
C
For derated power calculations
TH04
PD
Power Dissipation
—
W
PD = PINTERNAL + PI/O
TH05
PINTERNAL
Internal Power Dissipation
—
W
PINTERNAL = IDD x VDD
(NOTE 1)
TH06
PI/O
I/O Power Dissipation
—
W
PI/O =
Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))
TH07
PDER
Derated Power
—
W
PDER = (TJ - TA)/
θJA
(NOTE 2, 3)
Note 1:
IDD is current to run the chip alone without driving any load on the output pins.
2:
TA = Ambient Temperature.
3:
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (PDER).



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