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PIC16F684 датащи(PDF) 138 Page - Microchip Technology |
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PIC16F684 датащи(HTML) 138 Page - Microchip Technology |
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138 / 192 page ![]() PIC16F684 DS41202F-page 136 © 2007 Microchip Technology Inc. D100 IULP Ultra Low-Power Wake-Up Current — 200 — nA See Application Note AN879, “Using the Microchip Ultra Low-Power Wake-up Module” (DS00879) Capacitive Loading Specs on Output Pins D101* COSC2 OSC2 pin — — 15 pF In XT, HS and LP modes when external clock is used to drive OSC1 D101A* CIO All I/O pins — — 50 pF Data EEPROM Memory D120 ED Byte Endurance 100K 1M — E/W -40°C ≤ TA ≤ +85°C D120A ED Byte Endurance 10K 100K — E/W +85°C ≤ TA ≤ +125°C D121 VDRW VDD for Read/Write VMIN — 5.5 V Using EECON1 to read/write VMIN = Minimum operating voltage D122 TDEW Erase/Write Cycle Time — 5 6 ms D123 TRETD Characteristic Retention 40 — — Year Provided no other specifications are violated D124 TREF Number of Total Erase/Write Cycles before Refresh(4) 1M 10M — E/W -40°C ≤ TA ≤ +85°C Program Flash Memory D130 EP Cell Endurance 10K 100K — E/W -40°C ≤ TA ≤ +85°C D130A ED Cell Endurance 1K 10K — E/W +85°C ≤ TA ≤ +125°C D131 VPR VDD for Read VMIN —5.5 V VMIN = Minimum operating voltage D132 VPEW VDD for Erase/Write 4.5 — 5.5 V D133 TPEW Erase/Write cycle time — 2 2.5 ms D134 TRETD Characteristic Retention 40 — — Year Provided no other specifications are violated 15.5 DC Characteristics: PIC16F684-I (Industrial) PIC16F684-E (Extended) (Continued) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Sym Characteristic Min Typ† Max Units Conditions * These parameters are characterized but not tested. † Data in ‘Typ’ column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external clock in RC mode. 2: Negative current is defined as current sourced by the pin. 3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 4: See Section 10.4.1 “Using the Data EEPROM” for additional information. 5: Including OSC2 in CLKOUT mode. |
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