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IMX6SDLCEC датащи(PDF) 38 Page - NXP Semiconductors |
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IMX6SDLCEC датащи(HTML) 38 Page - NXP Semiconductors |
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38 / 169 page ![]() i.MX 6Solo/6DualLite Applications Processors for Consumer Products, Rev. 9, 11/2018 38 NXP Semiconductors Electrical Characteristics 4.4.6 Arm PLL 4.5 On-Chip Oscillators 4.5.1 OSC24M This block implements an amplifier that when combined with a suitable quartz crystal and external load capacitors implements an oscillator. The oscillator is powered from NVCC_PLL_OUT. The system crystal oscillator consists of a Pierce-type structure running off the digital supply. A straight forward biased-inverter implementation is used. 4.5.2 OSC32K This block implements an amplifier that when combined with a suitable quartz crystal and external load capacitors implements a low power oscillator. It also implements a power mux such that it can be powered from either a ~3 V backup battery (VDD_SNVS_IN) or VDD_HIGH_IN such as the oscillator consumes power from VDD_HIGH_IN when that supply is available and transitions to the back up battery when VDD_HIGH_IN is lost. In addition, if the clock monitor determines that the OSC32K is not present, then the source of the 32 kHz clock will automatically switch to the internal ring oscillator. CAUTION The internal RTC oscillator does not provide an accurate frequency and is affected by process, voltage, and temperature variations. NXP strongly recommends using an external crystal as the RTC_XTALI reference. If the internal oscillator is used instead, careful consideration must be given to the timing implications on all of the SoC modules dependent on this clock. The OSC32k runs from VDD_SNVS_CAP supply, which comes from VDD_HIGH_IN/VDD_SNVS_IN. Table 20. Arm PLL’s Electrical Parameters Parameter Value Clock output range 650 MHz ~ 1.3 GHz Reference clock 24 MHz Lock time <2250 reference cycles |
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