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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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DS2148 датащи(PDF) 62 Page - Dallas Semiconductor |
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DS2148 датащи(HTML) 62 Page - Dallas Semiconductor |
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62 / 75 page  DS2148/Q48 62 of 75 THERMAL CHARACTERISTICS OF DS21Q48 BGA PACKAGE PARAMETER MIN TYP MAX NOTES Ambient Temperature -40ºC - +85ºC 1 Junction Temperature - - +125ºC Theta-JA (θJA) in Still Air - +24ºC/W - 2 Theta-JC (θJC) in Still Air - +4.1ºC/W - 3 NOTES: 1) The package is mounted on a four-layer JEDEC-standard test board. 2) Theta-JA (θJA) is the junction to ambient thermal resistance, when the package is mounted on a four- layer JEDEC-standard test board. 3) While Theta-JC (θJC) is commonly used as the thermal parameter that provides a correlation between the junction temperature (Tj) and the average temperature on top center of four of the chip-scale BGA packages (TC), the proper term is Psi-JT. It is defined by: (TJ - TC) / overall package power The method of measurement of the thermal parameters is defined in EIA/JEDEC-standard document EIA-JESD51-2. THETA-JA (θJA) VERSUS AIRFLOW FORCED AIR (m/s) THETA-JA (θJA) 0 24ºC/W 1 21ºC/W 2.5 19ºC/W |
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