TMS570LS1114 datasheet(45/169 Pages) TI1

45 / 169 page

TMS570LS1114

www.ti.com

SPNS188B – OCTOBER 2012 – REVISED FEBRUARY 2015

5.8

Input/Output Electrical Characteristics Over Recommended Operating Conditions

(1)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Vhys

Input hysteresis

All inputs

180

VIL

Low-level input voltage

All inputs

-0.3

0.8

VIH

High-level input voltage

All inputs

VCCIO + 0.3

IOL = IOLmax

0.2 VCCIO

IOL = 50 µA, standard

0.2

output mode

VOL

Low-level output voltage

IOL = 50 µA, low-EMI

output mode (see

0.2 VCCIO

Section 5.13)

IOH = IOHmax

0.8 VCCIO

IOH = 50 µA, standard

VCCIO -0.3

output mode

VOH

High-level output voltage

IOH = 50 µA, low-EMI

output mode (see

0.8 VCCIO

Section 5.13)

VI < VSSIO - 0.3 or VI

IIK

Input clamp current (I/O pins)(2)

-3.5

3.5

> VCCIO + 0.3

IIH Pulldown 20µA

VI = VCCIO

IIH Pulldown 100µA

VI = VCCIO

195

Input current (I/O pins)

IIL Pullup 20µA

VI = VSS

-40

-5

µA

IIL Pullup 100µA

VI = VSS

-195

-40

All other pins

No pullup or pulldown

-1

Input capacitance

Output capacitance

(1)

Source currents (out of the device) are negative while sink currents (into the device) are positive.

(2)

If the input voltage extends outside of the range VIL to VIH then the input current must be limited to IIK to maintain proper operation. See

the application note SPNA201 for more information on limiting input clamp currents.

5.9

Thermal Resistance Characteristics

Table 5-2 shows the thermal resistance characteristics for the QFP - PGE mechanical package.

Table 5-3 shows the thermal resistance characteristics for the BGA - ZWT mechanical package.

Table 5-2. Thermal Resistance Characteristics (PGE Package)

°C/W

Junction-to-free air thermal resistance, Still

ΘJA

air using JEDEC 2S2P test board

ΘJB

Junction-to-board thermal resistance

27.2

ΘJC

Junction-to-case thermal resistance

7.3

ΨJT

Junction-to-package top, Still air

0.10

Table 5-3. Thermal Resistance Characteristics (ZWT Package)

°C/W

Junction-to-free air thermal resistance, Still

ΘJA

air (includes 5x5 thermal via cluster in 2s2p

18.8

PCB connected to 1st ground plane)

ΘJB

Junction-to-board thermal resistance

14.1

ΘJC

Junction-to-case thermal resistance

7.1

Specifications

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