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TMS570LS1114 датащи(PDF) 41 Page - Texas Instruments |
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TMS570LS1114 датащи(HTML) 41 Page - Texas Instruments |
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41 / 169 page ![]() TMS570LS1114 www.ti.com SPNS188B – OCTOBER 2012 – REVISED FEBRUARY 2015 5 Specifications 5.1 Absolute Maximum Ratings Over Operating Free-Air Temperature Range (1) MIN MAX UNIT VCC (2) -0.3 1.43 V Supply voltage range: VCCIO, VCCP (2) -0.3 4.6 V VCCAD -0.3 6.25 V All input pins, with exception of ADC pins -0.3 4.6 V Input voltage range: ADC input pins -0.3 6.25 V IIK (VI < 0 or VI > VCCIO) -20 +20 mA All pins, except AD1IN[23:0] or AD2IN[15:0] Input clamp current: IIK (VI < 0 or VI > VCCAD) -10 +10 mA AD1IN[23:0] or AD2IN[15:0] Total -40 +40 mA Operating free-air temperature range, TA: -40 125 °C Operating junction temperature range, TJ: -40 150 °C Storage temperature range, Tstg -65 150 °C (1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to their associated grounds. 5.2 ESD Ratings VALUE UNIT Human body model (HBM), per AEC Q100-002(1) ±2 kV Electrostatic discharge All pins ±500 V VESD Charged device model (CDM), (ESD) performance: Corner pins on 144-pin PGE per AEC Q100-011 ±750 V (1, 36, 37, 72, 73, 108, 109, 144) Corner balls on 337-ball ZWT ±750 V (A1, A19, W1, W19) (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS ‑001 specification. 5.3 Power-On Hours (POH) (1) (2) JUNCTION NOMINAL CORE VOLTAGE (VCC) LIFETIME POH TEMPERATURE (Tj) 1.2 105ºC 100K (1) This information is provided solely for your convenience and does not extend or modify the warranty provided under TI's standard terms and conditions for TI semiconductor products. (2) To avoid significant degradation, the device power-on hours (POH) must be limited to those specified in this table. To convert to equivalent POH for a specific temperature profile, see the Calculating Equivalent Power-on-Hours for Hercules Safety MCUs Application Report (SPNA207). Copyright © 2012–2015, Texas Instruments Incorporated Specifications 41 Submit Documentation Feedback Product Folder Links: TMS570LS1114 |
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