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MPF0900AMMA2ES датащи(PDF) 167 Page - NXP Semiconductors |
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MPF0900AMMA2ES датащи(HTML) 167 Page - NXP Semiconductors |
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167 / 205 page ![]() NXP Semiconductors PF09 Nine-channel power management IC with advanced system safety monitoring 14.11 Dynamic CRC (DCRC) The PF09 features a dynamic cyclic redundancy check (DCRC) routine to check the integrity of the functional and OTP configuration registers. The dynamic CRC is able to detect bit-flips in the configuration registers that could lead to a potential single-point or latent failure. A base CRC code is calculated and stored in memory every time a successful I2C transaction is made on the functional registers. The base CRC will be used as the reference value to compare with the check CRC code calculated every 5 ms. If the check CRC code is different from the base CRC code, the dynamic CRC routine is considered a bad dynamic CRC and the PF09 will generate a DCRC_I interrupt to report the fault condition. The dynamic CRC interrupt will assert the INTB pin if the interrupt is not masked. The dynamic CRC routine is performed within the PF09 logic and does not require any interaction with the system MCU, however, a fault condition in the dynamic CRC will require the MCU to evaluate and try to correct the fault condition, to ensure proper operation of the PMIC. A control flag DCRC_FLG bit is provided to help manage a dynamic CRC failure. The DCRC_FLG will be set when a bad dynamic CRC condition is present, and the MCU must clear the flag by writing a 1 to it after taking corrective action. When the DCRC_FLG is cleared, the PF09 will perform a new CRC check to ensure the registers' configuration has been corrected and is able to return to safe operation. A dynamic CRC fault condition can have two levels of severity: 1. The first level of severity includes all fault conditions affecting any of the functional registers. This type of fault can be addressed and fixed by the MCU during the SYSTEM ON states. The second level of severity includes a fault condition affecting any of the OTP configuration registers. This type of fault cannot be cleared by the MCU directly, and the MCU must take proper action to request a PMIC restart to force a clean OTP reload at power up. A dynamic CRC fault condition should be managed as follows: 1. When a dynamic CRC fault condition is present, the PF09 will notify the MCU and set the system into a safe state by asserting the FS0B pin. 2. The MCU must verify and/or reload the expected configuration in the functional registers before trying to clear the DCRC_FLG. 3. The MCU must clear the DCRC_FLG to force a new dynamic CRC calculation and read back the flag again. 4. If the DCRC_FLG was successfully cleared, it means the low-severity fault condition has been cleared, and the MCU can proceed to release the FS0B again. 5. If the DCRC_FLG flag is still present after clearing the DCRC_FLG, it means the high-severity fault is on the OTP registers and cannot be fixed. In this scenario, the MCU must place the system into a safe state before it can request a power-down event via the PWRON pin, or by sending a turnoff event via the SYS_CMD registers (0xA5). Fault conditions in the OTP registers will be mostly latent failures, therefore it is acceptable to allow the system to perform a safe turnoff event to avoid a sudden stop of operation causedby the PMIC. In devices with lower safety integrity level (ASIL B) where the FS0B pin is used as a programmable fault status output, the dynamic CRC can also drive the FS0B if FS0B_DCRC = 1. This allows the system to prioritize the dynamic CRC fault condition over a regular interrupt. The strategy to service the dynamic CRC fault is the same, regardless the mode of operation of the FS0B. 14.12 Digital machine supervisor In devices targeting high safety integrity levels (ASIL D / SIL 2) with the FS0B operating in an active safe state, the PF09 features an NXP proprietary digital machine supervisor (DMS) block to ensure the main digital control PF09 All information provided in this document is subject to legal disclaimers. © 2026 NXP B.V. All rights reserved. Product data sheet Rev. 1.3 — 16 December 2025 Document feedback 167 / 205 |
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