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ADBMS2950BCCSZ датащи(PDF) 95 Page - Analog Devices |
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ADBMS2950BCCSZ датащи(HTML) 95 Page - Analog Devices |
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95 / 97 page ![]() Data Sheet ADBMS2950B Rev. 0 | Page 95 of 97 FOOTPRINT RECOMMENDATION The recommended land pattern for the ADBMS2950B is shown in Figure 83. For optimum thermal connection of the IC to the PCB, it is recommended to add several vias into the exposed pad. To reduce solder voids and to avoid excessive creeping of the solder paste into the vias, the solder paste must be applied in a checkerboard style interleaved with the vias as shown in Figure 82. Figure 82. ADBMS2950B Footprint, Distribution of Vias, and Solder Paste |
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