PC755 datasheet(42/50 Pages) ATMEL

номер детали	PC755

подробное описание детали	PowerPC 755/745 RISC Microprocessor

PDF	50 Pages

Scroll/Zoom	100%

производитель	ATMEL [ATMEL Corporation]

домашняя страница	http://www.atmel.com

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PC755/745

2138D–HIREL–06/03

Mechanical Dimensions of the

PC755 CI-CGA Package

Figure 29 provides the mechanical dimensions and bottom surface nomenclature of

PC755, 360 CI-CGA package

Figure 29. Mechanical Dimensions and Bottom Surface Nomenclature of PC755 (CI-CGA)

Clock Relationship

Choices

The PC755’s PLL is configured by the PLL_CFG[0-3] signals. For a given SYSCLK

(bus) frequency, the PLL configuration signals set the internal CPU and VCO frequency

of operation. The PLL configuration for the PC755 is shown in Figure 31 for example

frequencies.

360X

12345 6789 10 11 12 13 14 15 16

0.3

0.15

171819

Millimeters

DIM

Min

Max

4.04 BSC

1.10

1.30

1.545

1.695

—0.60

0.79

0.990

25.00 BSC

6.75

25.00 BSC

7.87

0.2

A1 CORNER

0.2

0.82

0.9

0.10 BSC

0.25

0.35

1.27 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE A1 CORNER IS

DESIGNATED WITH A BALL MISSING

FROM THE ARRAY.

360 X

0.15

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