PC755 datasheet(16/50 Pages) ATMEL

16 / 50 page

PC755/745

2138D–HIREL–06/03

Notes:

1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not

guaranteed.

2. Revisions prior to Rev. 2.8 (Rev. E) offered different I/O voltage support.

3. 2.0V nominal.

4. 2.5V nominal.

5. 3.3V nominal.

Thermal Characteristics

Package Characteristics

Table 6 provides the package thermal characteristics for the PC755.

Notes:

1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) tempera-

ture, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

3. Per JEDEC JESD51-6 with the board horizontal.

Table 5. Recommended Operating Conditions

(1)

Recommended Value

Unit

300 MHz, 350 MHz

400 MHz

Characteristic

Symbol

Min

Max

Min

Max

Core supply voltage(3)

1.80

2.10

1.90

2.10

PLL supply voltage(3)

AVDD

1.80

2.10

1.90

2.10

L2 DLL supply voltage(3)

L2AV

1.80

2.10

1.90

2.10

Processor bus supply voltage(2)(4)(5)

BVSEL = 1

OVDD

2.375

2.625

2.375

2.625

3.135

3.465

3.135

3.465

L2 bus supply voltage(2)(4)(5)

L2VSEL = 1

L2OV

2.375

2.625

2.375

2.625

3.135

3.465

3.135

3.465

Input voltage

Processor bus

GND

OVDD

GND

OVDD

L2 Bus

GND

L2OV

GND

L2OV

JTAG Signals

GND

OVDD

GND

OVDD

Die-junction temperature

Military temperature range

-55

125

-55

125

°C

Industrial temperature

-40

110

-40

110

°C

Table 6. Package Thermal Characteristics

Characteristic

Symbol

Value

Unit

PC755

CBGA

PC755

PBGA

PC745

PBGA

Junction-to-ambient thermal resistance, natural convection(1)(2)

°C/W

Junction-to-ambient thermal resistance, natural convection, four-layer

(2s2p) board(1)(3)

JMA

°C/W

Junction-to-ambient thermal resistance, 200 ft./min. airflow, single-layer

(1s) board(1)(3)

JMA

°C/W

Junction-to-ambient thermal resistance, 200 ft./min. airflow, four-layer

(2s2p) board(1)(3)

JMA

°C/W

Junction-to-board thermal resistance(4)

°C/W

Junction-to-case thermal resistance(5)

< 0.1

°C/W

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