PC755 datasheet(18/50 Pages) ATMEL

18 / 50 page

PC755/745

2138D–HIREL–06/03

Figure 6. C4 Package with Head Sink Mounted to a Printed-circuit Board

Note the internal versus external package resistance.

Thermal Management

Assistance

The PC755 incorporates a thermal management assist unit (TAU) composed of a ther-

mal sensor, digital-to-analog converter, comparator, control logic, and dedicated

special-purpose registers (SPRs). Specifications for the thermal sensor portion of the

TAU are found in Table 9. More information on the use of this feature is given in the

Motorola PC755 RISC Microprocessor User’s manual.

Notes:

1. The temperature is the junction temperature of the die. The thermal assist unit’s raw

output does not indicate an absolute temperature, but must be interpreted by soft-

ware to derive the absolute junction temperature. For information about the use and

calibration of the TAU, see Motorola Application Note AN1800/D, “Programming the

Thermal Assist Unit in the PC750 Microprocessor”.

2. The comparator settling time value must be converted into the number of CPU clocks

that need to be written into the THRM3 SPR.

3. Guaranteed by design and characterization.

ExternalResistance

InternalResistance

Radiation

Convection

Radiation

Convection

Heat Sink

Printed ± Circuit Board

Thermal Interface Material

Package/Leads

Die Junction

Die/Package

Table 9. Thermal Sensor Specifications at Recommended Operating Conditions

(see Table 5)

Characteristic

Min

Max

Unit

Temperature range(1)

127

°C

Comparator settling time(2)(3)

–

Resolution(3)

–

°C

Accuracy(3)

-12

+12

°C

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