PC755 datasheet(19/50 Pages) ATMEL

номер детали	PC755

подробное описание детали	PowerPC 755/745 RISC Microprocessor

PDF	50 Pages

Scroll/Zoom	100%

производитель	ATMEL [ATMEL Corporation]

домашняя страница	http://www.atmel.com

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19 / 50 page

PC755/745

2138D–HIREL–06/03

Thermal Management

Information

This section provides thermal management information for the ceramic ball grid array

(BGA) package for air-cooled applications. Proper thermal control design is primarily

dependent upon the system-level design-the heat sink, airflow and thermal interface

material. To reduce the die-junction temperature, heat sinks may be attached to the

package by several methods-adhesive, spring clip to holes in the printed-circuit board or

package, and mounting clip and screw assembly; see Figure 7. This spring force should

not exceed 5.5 pounds of force.

Figure 7. Package Exploded Cross-Sectional View with Several Heat Sink Options

Ultimately, the final selection of an appropriate heat sink depends on many factors, such

as thermal performance at a given air velocity, spatial volume, mass, attachment

method, assembly, and cost.

Adhesive

Thermal Interface Material

Heat Sink

Clip

Printed ± Circuit Board

Option

BGA Package

PC755 датащи(PDF) 19 Page - ATMEL Corporation