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PC755 датащи(PDF) 3 Page - ATMEL Corporation

номер детали PC755
подробное описание детали  PowerPC 755/745 RISC Microprocessor
PDF  50 Pages
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производитель  ATMEL [ATMEL Corporation]
домашняя страница  http://www.atmel.com
Logo ATMEL - ATMEL Corporation

PC755 датащи(HTML) 3 Page - ATMEL Corporation

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PC755/745
2138D–HIREL–06/03
General Parameters
The following list provides a summary of the general parameters of the PC755:
Features
This section summarizes features of the PC755’s implementation of the PowerPC archi-
tecture. Major features of the PC755 are as follows:
Branch Processing Unit
Four instructions fetched per clock
One branch processed per cycle (plus resolving 2 speculations)
Up to 1 speculative stream in execution, 1 additional speculative stream in
fetch
512-entry branch history table (BHT) for dynamic prediction
64-entry, 4-way set associative Branch Target Instruction Cache (BTIC) for
eliminating branch delay slots
Dispatch Unit
Full hardware detection of dependencies (resolved in the execution units)
Dispatch two instructions to six independent units (system, branch,
load/store, fixed-point unit 1, fixed-point unit 2, floating-point)
Serialization control (predispatch, postdispatch, execution serialization)
Decode
Register file access
Forwarding control
Partial instruction decode
Completion
6 entry completion buffer
Instruction tracking and peak completion of two instructions per cycle
Completion of instructions in program order while supporting out-of-order
instruction execution, completion serialization and all instruction flow
changes
Fixed Point Units (FXUs) that share 32 GPRs for Integer Operands
Fixed Point Unit 1 (FXU1)-multiply, divide, shift, rotate, arithmetic, logical
Fixed Point Unit 2 (FXU2)-shift, rotate, arithmetic, logical
Technology
0.22 µm CMOS, six-layer metal
Die size
6.61 mm x 7.73 mm (51 mm
2)
Transistor count
6.75 million
Logic design
Fully-static Packages
PC745
Surface mount 255 Plastic Ball Grid Array (PBGA)
PC755
Surface mount 360 Plastic Ball Grid Array (PBGA)
Surface mount 360 Ceramic Ball Grid Array (CI-CGA, CBGA,
HiTCE)
Core power supply
2V ± 100 mV DC (nominal; some parts support core voltages
down to 1.8V; see Table 5 for recommended operating
conditions)
I/O power supply
2.5V ± 100 mV DC or 3.3V ± 165 mV DC (input thresholds are
configuration pin selectable)



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