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PC755 датащи(PDF) 24 Page - ATMEL Corporation |
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PC755 датащи(HTML) 24 Page - ATMEL Corporation |
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24 / 50 page ![]() 24 PC755/745 2138D–HIREL–06/03 Electrical Characteristics Static Characteristics Notes: 1. Nominal voltages; See Table 5 for recommended operating conditions. 2. For processor bus signals, the reference is OV DD while L2OVDD is the reference for the L2 bus signals. 3. Excludes test signals (LSSD_MODE, L1_TSTCLK, L2_TSTCLK) and IEEE 1149.1 boundary scan (JTAG) signals. 4. Capacitance is periodically sampled rather than 100% tested. 5. The leakage is measured for nominal OV DD and VDD, or both OVDD and VDD must vary in the same direction (for example, both OV DD and VDD vary by either +5% or -5%). Dynamic Characteristics After fabrication, parts are sorted by maximum processor core frequency as shown in the “Clock AC Specifications” Section on page 25 and tested for conformance to the AC specifications for that frequency. These specifications are for 275, 300, 333 MHz pro- cessor core frequencies. The processor core frequency is determined by the bus (SYSCLK) frequency and the settings of the PLL_CFG[0-3] signals. Parts are sold by maximum processor core frequency. Table 11. DC Electrical Specifications at Recommended Operating Conditions (see Table 5) Characteristic Nominal bus Voltage(1) Symbol Min Max Unit Input high voltage (all inputs except SYSLCK)(2)(3) 2.5 VIH 1.6 (L2)OVDD + 0.3 V 3.3 VIH 2 (L2)OVDD + 0.3 V Input low voltage (all inputs except SYSLCK)(2) 2.5 V IL -0.3 0.6 V 3.3 VIL -0.3 0.8 V SYSCLK input high voltage 2.5 KVIH 1.8 OVDD + 0.3 V 3.3 KV IH 2.4 OV DD + 0.3 V SYSCLK input low voltage 2.5 KVIL -0.3 0.4 V 3.3 KVIL -0.3 0.4 V Input leakage current, (2)(3) VIN = L2OVDD/OVDD I in – 10 µA Hi-Z (off-state) leakage current, (2)(3)(5) VIN = L2OVDD/OVDD I TSI – 10 µA Output high voltage, I OH = -6 mA 2.5 V OH 1.7 – V 3.3 VOH 2.4 – V Output low voltage, I OL = 6 mA 2.5 V OL – 0.45 V 3.3 V OL – 0.4 V Capacitance, VIN = 0V, f = 1 MHz (3)(4) Cin – 5 pF |
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