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MPF0900AMMA2ES датащи(PDF) 142 Page - NXP Semiconductors |
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MPF0900AMMA2ES датащи(HTML) 142 Page - NXP Semiconductors |
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142 / 205 page ![]() NXP Semiconductors PF09 Nine-channel power management IC with advanced system safety monitoring All parameters are specified at TA = -40 °C to 125 °C, unless otherwise noted. Typical values are characterized at VIN = 5 V and TA = 25 °C unless otherwise noted. Symbol Description Min Typ Max Unit • Max step size of 1.6 V • Bus capacitance 150 pF VCLAMP AMUX clamping voltage 1.8 – 2.5 V VDIV4V0 Input divider ratio by 4 tolerance 3.95 4 4.05 – VDIV2V5 Input divider ratio by 2.5 tolerance 2.48 2.5 2.52 – VDIV1V0 Input divider ratio by 1 tolerance 0.995 1 1.005 – Table 191. AMUX electrical characteristics...continued 13.6 Thermal monitors The PF09 features nine temperature sensors spread around the die. The main thermal management sensor is located at the center of the die, and the rest are located in the vicinity of the voltage regulators: • Center of die • Vicinity of SW1 • Vicinity of SW2 • Vicinity of SW3 • Vicinity of SW4 • Vicinity of SW5 • Vicinity of LDO1 • Vicinity of LDO2 • Vicinity of LDO3 The output of the temperature sensors is internally connected to the AMUX, allowing the user to read the raw voltage equivalent to the temperature on each sensor. Sensor temperature at any point is calculated with the following formula: Where VTSENSE is the thermal sensor voltage measured on the corresponding AMUX channel. The temperature sensor at the center of the die is used to generate thermal interrupts and thermal shutdown. The processor can read outputs of the other temperature sensors and take appropriate action (such as reducing loading, or turning off a regulator) if the temperature exceeds desired limits at any point in the die. PF09 All information provided in this document is subject to legal disclaimers. © 2026 NXP B.V. All rights reserved. Product data sheet Rev. 1.3 — 16 December 2025 Document feedback 142 / 205 |
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