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FS5502 датащи(PDF) 69 Page - NXP Semiconductors

номер детали FS5502
подробное описание детали  High voltage PMIC with multiple SMPS and LDO
PDF  113 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

FS5502 датащи(HTML) 69 Page - NXP Semiconductors

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NXP Semiconductors
FS5502
High voltage PMIC with multiple SMPS and LDO
16.4 BUCK3 electrical characteristics
TA = −40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UVH to 36 V, unless otherwise specified. All voltages referenced to ground.
Symbol
Parameter
Min
Typ
Max
Unit
VBUCK3_IN
Input voltage range
2.5
—
5.5
V
VBUCK3
Output voltage (OTP_VB3V[4:0] bits)
1.0 V, 1.1 V, 1.2 V, 1.25 V, 1.3 V, 1.35 V,
1.5 V, 1.6 V, 1.8 V, 2.3 V, 2.5 V, 2.8 V, 3.3 V
1.0
—
3.3
V
IBUCK3
DC output current capability
—
2.5
—
A
VBUCK3_ACC
Output voltage accuracy (Iout < 2.5 A)
−2
—
+2
%
VBUCK3_SW
Switching frequency range
2.1
2.22
2.35
MHz
LBUCK3
Inductor for VBUCK3_SW = 2.22 MHz (OTP_VB3INDOPT[1:0] bits)
0.47
1.0
1.5
μH
Effective output capacitor
40
—
120
μF
COUT_BUCK3
Output decoupling capacitor
—
0.1
—
μF
Effective input capacitor (close to BUCK3_IN pin)
4.7
—
—
μF
CIN_BUCK3
Input decoupling capacitor (close to BUCK3_IN pin)
—
0.1
—
μF
VBUCK3_TLR
Transient load regulation (Cout = 44 μF, from 200 mA to 1.0 A, di/
dt = 2.0 A/μs)
−50
—
+50
mV
2.0
2.6
3.1
A
ILIM_BUCK3
Inductor peak current limitation range (OTP_VB3SWILIM[1:0] bits)
3.6
4.5
5.45
A
TBUCK3_ON_MIN
HS minimum ON time
5
50
80
ns
Ramp up and ramp down speed, OTP_DVS_BUCK3[1:0] = 00
7.81
10.42
13.02
mV/µs
Ramp up and ramp down speed, OTP_DVS_BUCK3[1:0] = 01
2.6
3.47
4.34
mV/µs
Ramp up and ramp down speed, OTP_DVS_BUCK3[1:0] = 10
1.95
2.6
3.26
mV/µs
VBUCK3_DVS_UP_DOWN
Ramp up and ramp down speed, OTP_DVS_BUCK3[1:0] = 11
1.56
2.08
2.60
mV/µs
TBUCK3_SOFT_START = VBUCK3 / VBUCK3_DVS_UP
Soft start for VBUCK3 = 1.1 V and OTP_DVS_BUCK3[1:0] = 00
84.8
105.6
140.08
μs
TBUCK3_SOFT_START
Soft start for VBUCK3 = 1.1 V and OTP_DVS_BUCK3[1:0] = 11
To be recalculated for different VBUCK3 and different
VBUCK3_DVS_UP_DOWN
422.4
528
704
μs
VBUCK3_STARTUP
Overshoot at startup
—
—
50
mV
TBUCK3_DT
Dead time to avoid cross conduction
0.01
3
20
ns
RBUCK3_HS_RON
HS PMOS RDSon
—
—
135
mΩ
RBUCK3_LS_RON
LS NMOS RDSon
—
—
80
mΩ
RBUCK3_DISCH
Discharge resistance (when BUCK3 is disabled)
250
500
1000
Ω
TSDBUCK3
Thermal shutdown threshold
160
—
—
°C
TSDBUCK3_HYST
Thermal shutdown threshold hysteresis
—
9
—
°C
TBUCK3_TSD
Thermal shutdown filtering time
3
5
8
μs
Table 65. BUCK3 electrical characteristics
16.5 BUCK3 efficiency
BUCK3 efficiency versus current load is given for information based on external
component criteria provided and VPRE voltage 4.1 V. If the conditions change, it has to
be recalculated with the FS5502_PDTCAL tool. The real efficiency has to be verified by
measurement at the application level.
FS5502
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2021. All rights reserved.
Product data sheet
Rev. 4 — 27 October 2021
69 / 113



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