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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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UCS81003 датащи(PDF) 104 Page - Microchip Technology |
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UCS81003 датащи(HTML) 104 Page - Microchip Technology |
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104 / 108 page  UCS81003 DS20005334A-page 104 2014 Microchip Technology Inc. RECOMMENDED LAND PATTERN For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 3.00 2.70 MILLIMETERS 0.50 BSC MIN E MAX 4.70 Contact Pad Length (X28) Contact Pad Width (X28) Y1 X1 1.05 0.30 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. Dimensioning and tolerancing per ASME Y14.5M Microchip Technology Drawing C04-2334A NOM SILK SCREEN 1 2 28 C1 Contact Pad Spacing 4.70 Contact Pad to Center Pad (X28) (G1) 0.475 REF C2 C1 X2 Y2 X1 E Y1 (G1) 28-Lead Very Thin Plastic Quad Flat, No Lead Package (PV) - 5x5 mm Body [VQFN] With Rectangular Exposed Pad EV EV ØV Thermal Via Diameter V 0.30 Thermal Via Pitch EV 1.00 |
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