LP3913 datasheet(5/70 Pages) TI1

5 / 70 page

LP3913

www.ti.com

SNVS489I – NOVEMBER 2006 – REVISED SEPTEMBER 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1) (2) (3) (4)

Supply voltage range CHG_DET

−0.3V to +6.5V

Voltage range USBPWR,

VIN1,VIN2,VIN3,VIN4, VDD1,VDD2,VDD3

−0.3V to +6.2V

Battery voltage range VBATT1, 2, 3

−0.3V to +5V

All other pins

−0.3V to VDD +0.3V

Storage Temperature Range

−45ºC to +150ºC

Power Dissipation (TA = 70°C

(5)):

2.6W

ESD Rating (6)

Human Body Model:

2.0 kV

Machine Model:

200V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test

conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP − (θJA × PD-MAX).

(4)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(5)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typ.) and

disengages at TJ = 140°C (typ.).

(6)

The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. The machine model is a 200 pF

capacitor discharged directly into each pin. MIL-STD-883 3015.7.

RECOMMENDED OPERATING CONDITIONS

(1) (2) (3)

CHG_DET

4.5V to 6.0V

USBPWR

4.35V to 6.0V

VBATT1, 2, 3

0V to 4.5V

VIN1, VIN2, VIN3, VIN4, VDD1, VDD2, VDD3

2.5V to 6.0V

VDDIO

2.5V to VDD

Junction Temperature (TJ) Range

−40°C to +125°C

Ambient Temperature (TA) Range

−40°C to +85°C

Power Dissipation for TJjMAX and TAMAX

1.6W

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

(2)

Min and Max limits are specified by design, test, or statistical analysis. Typical numbers represent the most likely norm.

(3)

Typical values and limits appearing in normal type for TJ = 25°C. Limits appearing in boldface type apply over the entire junction

temperature range for operation,

−40°C to +125°C.

THERMAL INFORMATION

(1)

Junction-to-Ambient Thermal Resistance (

θJA),

25°C/W

48-pin WQFN NJV0048A Package (2)

(1)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP − (θJA × PD-MAX).

(2)

Min and Max limits are specified by design, test, or statistical analysis. Typical numbers represent the most likely norm.

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