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TDA8029HL/C2 датащи(PDF) 47 Page - NXP Semiconductors |
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TDA8029HL/C2 датащи(HTML) 47 Page - NXP Semiconductors |
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47 / 58 page ![]() 2003 Oct 30 47 Philips Semiconductors Product specification Low power single card reader TDA8029 9 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). Note 1. Human body model as defined in JEDEC Standard JESD22-A114-B, dated June 2000. 10 HANDLING Inputs and outputs are protected against electrostatic discharge voltages during normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. 11 THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDCIN input voltage for the DC/DC converter −0.5 +6.5 V VDD supply voltage −0.5 +6.5 V Vn voltage limit on pins SAM, SBM, SAP, SBP and VUP −0.5 7.5 V on all other pins −0.5 VDD + 0.5 V Ptot continuous total power dissipation Tamb = −40 to +90 °C − 500 mW Tstg storage temperature −55 +150 °C Tj junction temperature − 125 °C Vesd electrostatic discharge voltage human body model; note 1 on pins I/O, VCC, RST, CLK and GNDC −6+6 kV on pin PRES −3+3 kV on pins SAM and SBM −1+1 kV on other pins −2+2 kV SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-a) thermal resistance from junction to ambient in free air 80 K/W |
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