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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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OR2C04A датащи(PDF) 113 Page - List of Unclassifed Manufacturers |
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OR2C04A датащи(HTML) 113 Page - List of Unclassifed Manufacturers |
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113 / 192 page  Data Sheet June 1999 ORCA Series 2 FPGAs Lucent Technologies Inc. 113 A12 PT7B PT8B PT9B PT10D PT13D I/O B11 PT7A PT8A PT9A PT10A PT13A I/O-D0/DIN C12 PT6D PT7D PT8D PT9D PT12D I/O A11 PT6C PT7C PT8C PT9A PT12A I/O D12 PT6B PT7B PT8B PT8D PT11D I/O B10 PT6A PT7A PT8A PT8A/ PT11A I/O-DOUT C11 PT5D PT6D PT7D PT7D PT10D I/O A10 PT5C PT6C PT7C PT7C PT10A I/O D10 PT5B PT6B PT7B PT7B PT9D I/O B9 PT5A PT6A PT7A PT7A PT9A I/O C10 PT4D PT5D PT6D PT6D PT8D I/O A9 PT4C PT5C PT6C PT6C PT8A I/O B8 PT4B PT5B PT6B PT6B PT7D I/O A8 PT4A PT5A PT6A PT6A PT7A I/O-TDI C9 — PT4D PT5D PT5D PT6D I/O B7 PT3D PT4C PT5C PT5C PT6C I/O D8 — PT4B PT5B PT5B PT6B I/O A7 PT3C PT4A PT5A PT5A VDD5 I/O-VDD5 C8 — PT3D PT4D PT4D PT5D I/O B6 PT3B PT3C PT4C PT4C PT5C I/O D7 — PT3B PT4B PT4B PT5B I/O A6 PT3A PT3A PT4A PT4A PT5A I/O-TMS C7 PT2D PT2D PT3D PT3D PT4D I/O B5 PT2C PT2C PT3A PT3A PT4A I/O A5 PT2B PT2B PT2D PT2D PT3D I/O C6 — — PT2C PT2C PT3C I/O B4 — — PT2B PT2B PT3B I/O D5 PT2A PT2A PT2A PT2A PT3A I/O A4 PT1D PT1D PT1D PT1D PT2D I/O C5 PT1C PT1C PT1C PT1C PT2A I/O B3 PT1B PT1B PT1B PT1B PT1D I/O C4 PT1A PT1A PT1A PT1A PT1A I/O-TCK A3 RD_DATA/TDO RD_DATA/TDO RD_DATA/TDO RD_DATA/TDO RD_DATA/TDO RD_DATA/ TDO A1 VSS VSS VSS VSS VSS VSS A2 VSS VSS VSS VSS VSS VSS A26 VSS VSS VSS VSS VSS VSS AC13 VSS VSS VSS VSS VSS VSS AC18 VSS VSS VSS VSS VSS VSS AC23 VSS VSS VSS VSS VSS VSS Pin Information (continued) Table 27. OR2C/2T10A, OR2C/2T12A, OR2C/2T15A/B, OR2C/2T26A, and OR2T40A/B 352-Pin PBGA Pinout (continued) Pin 2C/2T10A Pad 2C/2T12A Pad 2C/2T15A/B Pad 2C/2T26A Pad OR2T40A/B Pad Function Notes: The pins labeled I/O-VDD5 are user I/Os for the OR2CxxA and OR2TxxB series, but they are connected to VDD5 for the OR2TxxA series. The pins labeled VSS-ETC are the 6 x 6 array of thermal balls located at the center of the package. The balls can be attached to the ground plane of the board for enhanced thermal capability (see Table 29), or they can be left unconnected. |
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