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OR2C04A датащи(PDF) 55 Page - List of Unclassifed Manufacturers |
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OR2C04A датащи(HTML) 55 Page - List of Unclassifed Manufacturers |
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55 / 192 page ![]() Data Sheet June 1999 ORCA Series 2 FPGAs Lucent Technologies Inc. 55 Special Function Blocks (continued) 5-4488(F) Figure 48. Boundary-Scan Interface VDD EPROM PROGRAM D[7:0] OE CE A[17:0] A[17:0] D[7:0] DONE M2 M1 M0 DONE HDC LDC RCLK CCLK DOUT DIN DOUT DIN CCLK DONE DOUT INIT INIT INIT CCLK VDD VDD OR GND PRGM PRGM M2 M1 M0 PRGM M2 M1 M0 VDD VDD HDC LDC RCLK HDC LDC RCLK VDD ORCA SERIES FPGA SLAVE #2 ORCA SERIES FPGA MASTER ORCA SERIES FPGA SLAVE #1 The BSM also increases test throughput with a dedi- cated automatic test-pattern generator and with com- pression of the test response with a signature analysis register. The PC-based boundary-scan test card/soft- ware allows a user to quickly prototype a boundary- scan test setup. Boundary-Scan Instructions The ORCA Series boundary-scan circuitry is used for three mandatory IEEE 1149.1 tests (EXTEST, SAM- PLE/PRELOAD, BYPASS) and four ORCA-defined instructions. The 3-bit wide instruction register sup- ports the eight instructions listed in Table 12. Table 12. Boundary-Scan Instructions The external test (EXTEST) instruction allows the inter- connections between ICs in a system to be tested for opens and stuck-at faults. If an EXTEST instruction is performed for the system shown in Figure 47, the con- nections between U1 and U2 (shown by nets a, b, and c) can be tested by driving a value onto the given nets from one device and then determining whether the same value is seen at the other device. This is deter- mined by shifting 2 bits of data for each pin (one for the output value and one for the 3-state value) through the BSR until each one aligns to the appropriate pin. Then, based upon the value of the 3-state signal, either the I/O pad is driven to the value given in the BSR, or the BSR is updated with the input value from the I/O pad, which allows it to be shifted out TDO. The SAMPLE instruction is useful for system debug- ging and fault diagnosis by allowing the data at the FPGA’s I/Os to be observed during normal operation. The data for all of the I/Os is captured simultaneously into the BSR, allowing them to be shifted-out TDO to the test host. Since each I/O buffer in the PICs is bidi- rectional, two pieces of data are captured for each I/O pad: the value at the I/O pad and the value of the 3-state control signal. Code Instruction 000 EXTEST 001 PLC Scan Ring 1 010 RAM Write (RAM_W) 011 Reserved 100 SAMPLE/PRELOAD 101 PLC Scan Ring 2 110 RAM Read (RAM_R) 111 BYPASS |
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