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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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OR2C04A датащи(PDF) 94 Page - List of Unclassifed Manufacturers |
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OR2C04A датащи(HTML) 94 Page - List of Unclassifed Manufacturers |
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94 / 192 page  Data Sheet ORCA Series 2 FPGAs June 1999 94 Lucent Technologies Inc. W10 PB6A PB7A PB8A PB9A PB10A I/O V10 PB6B PB7B PB8B PB9B PB10B I/O Y10 PB6C PB7C PB8C PB9C PB10C I/O Y11 PB6D PB7D PB8D PB9D PB10D I/O W11 PB7A PB8A PB9A PB10A PB11A I/O V11 PB7B PB8B PB9B PB10B PB11B I/O U11 PB7C PB8C PB9C PB10C PB11C I/O Y12 PB7D PB8D PB9D PB10D PB11D I/O W12 PB8A PB9A PB10A PB11A PB12A I/O-VDD5 V12 PB8B PB9B PB10B PB11B PB12B I/O U12 PB8C PB9C PB10C PB11C PB12C I/O Y13 PB8D PB9D PB10D PB11D PB12D I/O W13 PB9A PB10A PB11A PB12A PB13A I/O-HDC V13 PB9B PB10B PB11B PB12B PB13B I/O Y14 PB9C PB10C PB11C PB12C PB13C I/O W14 PB9D PB10D PB11D PB12D PB13D I/O Y15 PB10A PB11A PB12A PB13A PB14A I/O-LDC V14 PB10B PB11B PB12C PB13B PB14B I/O W15 PB10C PB11C PB12D PB13C PB14C I/O Y16 PB10D PB11D PB13A PB13D PB14D I/O U14 — PB12A PB13B PB14A PB15A I/O V15 — PB12B PB13C PB14D PB15D I/O W16 PB11A PB12C PB13D PB15A PB16A I/O-INIT Y17 — — PB14A PB15D PB16D I/O V16 — PB12D PB14B PB16A PB17A I/O-VDD5 W17 PB11B PB13A PB15A PB16D PB17D I/O Y18 PB11C PB13B PB15B PB17A PB18A I/O U16 PB11D PB13C PB15C PB17C PB18D I/O V17 PB12A PB13D PB15D PB17D PB19A I/O W18 PB12B PB14A PB16A PB18A PB19D I/O Y19 PB12C PB14B PB16B PB18B PB20A I/O V18 PB12D PB14C PB16C PB18C PB20B I/O W19 — PB14D PB16D PB18D PB20D I/O Y20 DONE DONE DONE DONE DONE DONE W20 RESET RESET RESET RESET RESET RESET V19 PRGM PRGM PRGM PRGM PRGM PRGM U19 PR12A PR14A PR16A PR18A PR20A I/O-M0 U18 — PR14C PR16C PR18C PR20D I/O T17 — PR14D PR16D PR18D PR19A I/O V20 — PR13A PR15A PR17A PR19D I/O Pin Information (continued) Table 25. OR2C/2T06A, OR2C/2T08A, OR2C/2T10A, OR2C/2T12A, and OR2C/2T15A/B 256-Pin PBGA Pinout (continued) Pin 2C/2T06A Pad 2C/2T08A Pad 2C/2T10A Pad 2C/2T12A Pad 2C/2T15A/B Pad Function Notes: The W3 pin on the 256-pin PBGA package is unconnected for all devices listed in this table. The OR2C/2T08A do not have bond pads connected to the 256-pin PBGA package pins F2 and Y17. The pins labeled I/O-VDD5 are user I/Os for the OR2CxxA and OR2TxxB series, but they are connected to VDD5 for the OR2TxxA series. The pins labeled VSS-ETC are the 4 x 4 array of thermal balls located at the center of the package. The balls can be attached to the ground plane of the board for enhanced thermal capability (see Table 29), or they can be left unconnected. |
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