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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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OR2C04A датащи(PDF) 108 Page - List of Unclassifed Manufacturers |
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OR2C04A датащи(HTML) 108 Page - List of Unclassifed Manufacturers |
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108 / 192 page  Data Sheet ORCA Series 2 FPGAs June 1999 108 Lucent Technologies Inc. AE3 — — PB1B PB1B PB1B I/O AF3 PB1B PB1B PB1C PB1C PB2A I/O AE4 PB1C PB1C PB1D PB1D PB2D I/O AD4 PB1D PB1D PB2A PB2A PB3A I/O AF4 PB2A PB2A PB2D PB2D VDD5 I/O-VDD5 AE5 — PB2B PB3A PB3A PB4A I/O AC5 PB2B PB2C PB3C PB3C PB4C I/O AD5 — PB2D PB3D PB3D PB4D I/O AF5 PB2C PB3A PB4A PB4A PB5A I/O AE6 PB2D PB3B PB4B PB4B PB5B I/O AC7 PB3A PB3C PB4C PB4C PB5C I/O AD6 PB3B PB3D PB4D PB4D PB5D I/O-A17 AF6 — PB4A PB5A PB5A PB6A I/O AE7 PB3C PB4B PB5B PB5B PB6B I/O AF7 — PB4C PB5C PB5C PB6C I/O AD7 PB3D PB4D PB5D PB5D PB6D I/O AE8 PB4A PB5A PB6A PB6A PB7A I/O AC9 PB4B PB5B PB6B PB6B PB7D I/O AF8 PB4C PB5C PB6C PB6C PB8A I/O AD8 PB4D PB5D PB6D PB6D PB8D I/O AE9 PB5A PB6A PB7A PB7A PB9A I/O AF9 PB5B PB6B PB7B PB7B PB9D I/O AE10 PB5C PB6C PB7C PB7C PB10A I/O AD9 PB5D PB6D PB7D PB7D PB10D I/O AF10 PB6A PB7A PB8A PB8A PB11A I/O AC10 PB6B PB7B PB8B PB8D PB11D I/O AE11 PB6C PB7C PB8C PB9A PB12A I/O AD10 PB6D PB7D PB8D PB9D PB12D I/O AF11 PB7A PB8A PB9A PB10A PB13A I/O AE12 PB7B PB8B PB9B PB10D PB13D I/O AF12 PB7C PB8C PB9C PB11A PB14A I/O AD11 PB7D PB8D PB9D PB11D PB14D I/O AE13 PB8A PB9A PB10A PB12A PB15A I/O AC12 PB8B PB9B PB10B PB12B PB15B I/O AF13 PB8C PB9C PB10C PB12C PB15C I/O AD12 PB8D PB9D PB10D PB12D PB15D I/O AE14 PB9A PB10A PB11A PB13A PB16A I/O AC14 PB9B PB10B PB11B PB13B PB16B I/O AF14 PB9C PB10C PB11C PB13C PB16C I/O Pin Information (continued) Table 27. OR2C/2T10A, OR2C/2T12A, OR2C/2T15A/B, OR2C/2T26A, and OR2T40A/B 352-Pin PBGA Pinout (continued) Pin 2C/2T10A Pad 2C/2T12A Pad 2C/2T15A/B Pad 2C/2T26A Pad OR2T40A/B Pad Function Notes: The pins labeled I/O-VDD5 are user I/Os for the OR2CxxA and OR2TxxB series, but they are connected to VDD5 for the OR2TxxA series. The pins labeled VSS-ETC are the 6 x 6 array of thermal balls located at the center of the package. The balls can be attached to the ground plane of the board for enhanced thermal capability (see Table 29), or they can be left unconnected. |
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