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SC16IS752IPW датащи(PDF) 56 Page - NXP Semiconductors |
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SC16IS752IPW датащи(HTML) 56 Page - NXP Semiconductors |
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56 / 59 page ![]() SC16IS752_SC16IS762_7 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 07 — 19 May 2008 56 of 59 NXP Semiconductors SC16IS752/SC16IS762 Dual UART with I2C-bus/SPI interface, 64-byte FIFOs, IrDA SIR For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 18. Abbreviations MSL: Moisture Sensitivity Level Fig 39. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature Table 42. Abbreviations Acronym Description CPU Central Processing Unit DLL Divisor Latch LSB DLH Divisor Latch MSB FIFO First In, First Out GPIO General Purpose Input/Output I2C-bus Inter IC bus IrDA Infrared Data Association LCD Liquid Crystal Display MIR Medium InfraRed POR Power-On Reset SIR Serial InfraRed SPI Serial Peripheral Interface SPR ScratchPad Register UART Universal Asynchronous Receiver/Transmitter |
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