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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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SC16IS752IPW датащи(PDF) 53 Page - NXP Semiconductors |
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SC16IS752IPW датащи(HTML) 53 Page - NXP Semiconductors |
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53 / 59 page  SC16IS752_SC16IS762_7 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 07 — 19 May 2008 53 of 59 NXP Semiconductors SC16IS752/SC16IS762 Dual UART with I2C-bus/SPI interface, 64-byte FIFOs, IrDA SIR Fig 38. Package outline SOT617-1 (HVQFN32) 0.5 1 A1 Eh b UNIT y e 0.2 c REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 5.1 4.9 Dh 3.25 2.95 y1 5.1 4.9 3.25 2.95 e1 3.5 e2 3.5 0.30 0.18 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT617-1 MO-220 - - - - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT617-1 HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A(1) max. A A1 c detail X y y1 C e L Eh Dh e e1 b 916 32 25 24 17 8 1 X D E C B A e2 terminal 1 index area terminal 1 index area 01-08-08 02-10-18 1/2 e 1/2 e A C C B v M w M E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) |
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