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SC9RS08KA2 датащи(PDF) 111 Page - Freescale Semiconductor, Inc |
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SC9RS08KA2 датащи(HTML) 111 Page - Freescale Semiconductor, Inc |
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111 / 134 page ![]() Appendix A Electrical Characteristics SC9RS08KA2 Series Data Sheet, Rev. 1 Freescale Semiconductor 111 PD = K ÷ (TJ + 273°C) Eqn. A-2 Solving Equation A-1 and Equation A-2 for K gives: K = PD × (TA + 273°C) + θJA × (PD) 2 Eqn. A-3 where K is a constant pertaining to the particular part. K can be determined from Equation A-3 by measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations 1 and 2 iteratively for any value of TA. A.4 Electrostatic Discharge (ESD) Protection Characteristics Although damage from static discharge is much less common on these devices than on early CMOS circuits, normal handling precautions should be used to avoid exposure to static discharge. Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels of static without suffering any permanent damage. All ESD testing is in conformity with CDF-AEC-Q00 Stress Test Qualification for Automotive Grade Integrated Circuits. (http://www.aecouncil.com/) A device is considered to have failed if, after exposure to ESD pulses, the device no longer meets the device specification requirements. Complete dc parametric and functional testing is performed per the applicable device specification at room temperature followed by hot temperature, unless specified otherwise in the device specification. A.5 DC Characteristics This section includes information about power supply requirements, I/O pin characteristics, and power supply current in various operating modes. Table A-3. ESD Protection Characteristics Parameter Symbol Value Unit ESD Target for Machine Model (MM) MM circuit description VTHMM 200 V ESD Target for Human Body Model (HBM) HBM circuit description VTHHBM 2000 V Table A-4. DC Characteristics (Temperature Range = –40 to 85 °C Ambient) Parameter Symbol Min Typical Max Unit Supply voltage (run, wait and stop modes.) 0 < fBus <10MHz VDD 1.8 — 5.5 V Minimum RAM retention supply voltage applied to VDD VRAM 0.8 1 —— V Low-voltage Detection threshold (VDD falling) (VDD rising) VLVD 1.80 1.88 1.86 1.94 1.95 2.03 V Power on RESET (POR) voltage VPOR 0.9 1.4 1.7 V Input high voltage (VDD > 2.3V) (all digital inputs) VIH 0.70 × V DD —— V Input high voltage (1.8 V ≤ V DD ≤ 2.3 V) (all digital inputs) VIH 0.85 × V DD —— V |
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