SC9RS08KA2 datasheet(110/134 Pages) FREESCALE

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Appendix A Electrical Characteristics

SC9RS08KA2 Series Data Sheet, Rev. 1

110

Freescale Semiconductor

A.3

Thermal Characteristics

This section provides information about operating temperature range, power dissipation, and package

thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in

on-chip logic and voltage regulator circuits and it is user-determined rather than being controlled by the

MCU design. In order to take PI/O into account in power calculations, determine the difference between

actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of

unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very

small.

The average chip-junction temperature (TJ) in °C can be obtained from:

TJ = TA + (PD × θJA)

Eqn. A-1

where:

TA = Ambient temperature, °C

θJA = Package thermal resistance, junction-to-ambient, °C/W

PD = Pint + PI/O

Pint = IDD × VDD, Watts — chip internal power

PI/O = Power dissipation on input and output pins — user determined

For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ

(if PI/O is neglected) is:

Table A-2. Thermal Characteristics

Rating

Symbol

Value

Unit

Operating temperature range (packaged)

TL to TH

–40 to 85

°C

Maximum junction temperature

TJMAX

105

°C

Thermal resistance 1,2,3,4

6-pin DFN

2s2p

8-pin PDIP

2s2p

8-pin SOIC

2s2p

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance,

mounting site (board) temperature, ambient temperature, air flow, power dissipation of other

components on the board, and board thermal resistance.

2 Junction to Ambient Natural Convection

3 1s - Single Layer Board, one signal layer

4 2s2p - Four Layer Board, 2 signal and 2 power layers

225

115

160

°C/W

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