MSP430 datasheet(13/96 Pages) TI2

13 / 96 page

MSP430G2533, MSP430G2433, MSP430G2333, MSP430G2233

MSP430G2403, MSP430G2303, MSP430G2203

www.ti.com

SLAS734G – APRIL 2011 – REVISED APRIL 2016

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Product Folder Links: MSP430G2533 MSP430G2433 MSP430G2333 MSP430G2233 MSP430G2403 MSP430G2303

MSP430G2203

Specifications

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages referenced to VSS. The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is

applied to the TEST pin when blowing the JTAG fuse.

(3)

Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow

temperatures not higher than classified on the device label on the shipping boxes or reels.

Specifications

5.1

Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Voltage applied at VCC to VSS

–0.3

4.1

Voltage applied to any pin(2)

–0.3

VCC + 0.3

Diode current at any device pin

±2

Storage temperature, Tstg

(3)

Unprogrammed device

–55

150

°C

Programmed device

–55

150

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as

±1000 V may actually have higher performance.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±250 V

may actually have higher performance.

5.2

ESD Ratings

VALUE

UNIT

V(ESD) Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±250

(1)

The MSP430 CPU is clocked directly with MCLK. Both the high and low phases of MCLK must not exceed the pulse duration of the

specified maximum frequency.

(2)

Modules might have a different maximum input clock specification. See the specification of the respective module in this data sheet.

5.3

Recommended Operating Conditions

Typical values are specified at VCC = 3.3 V and TA = 25°C (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

During program execution

1.8

3.6

During flash programming or erase

2.2

3.6

VSS

Supply voltage

Operating free-air temperature

–40

°C

fSYSTEM

Processor frequency (maximum MCLK frequency

using the USART module)(1)(2)

VCC = 1.8 V,

Duty cycle = 50% ±10%

MHz

VCC = 2.7 V,

Duty cycle = 50% ±10%

VCC = 3.3 V,

Duty cycle = 50% ±10%

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