TMPR4937 datasheet(36/552 Pages) TOSHIBA

36 / 552 page

3 General Safety Precautions and Usage Considerations

3-14

(3) Do not rub device markings with a brush or with your hand during cleaning or while the devices are still

wet from the cleaning agent. Doing so can rub off the markings.

(4) The dip cleaning, shower cleaning and steam cleaning processes all involve the chemical action of a

solvent. Use only recommended solvents for these cleaning methods. When immersing devices in a solvent

or steam bath, make sure that the temperature of the liquid is 50°C or below, and that the circuit board is

removed from the bath within one minute.

(5) Ultrasonic cleaning should not be used with hermetically-sealed ceramic packages such as a leadless chip

carrier (LCC), pin grid array (PGA) or charge-coupled device (CCD), because the bonding wires can

become disconnected due to resonance during the cleaning process. Even if a device package allows

ultrasonic cleaning, limit the duration of ultrasonic cleaning to as short a time as possible, since long hours

of ultrasonic cleaning degrade the adhesion between the mold resin and the frame material. The following

ultrasonic cleaning conditions are recommended:

Frequency: 27 kHz

∼ 29 kHz

Ultrasonic output power: 300 W or less (0.25 W/cm2 or less)

Cleaning time: 30 seconds or less

Suspend the circuit board in the solvent bath during ultrasonic cleaning in such a way that the ultrasonic

vibrator does not come into direct contact with the circuit board or the device.

3.5.5

No cleaning

If analog devices or high-speed devices are used without being cleaned, flux residues may cause minute amounts

of leakage between pins. Similarly, dew condensation, which occurs in environments containing residual

chlorine when power to the device is on, may cause between-lead leakage or migration. Therefore, Toshiba

recommends that these devices be cleaned.

However, if the flux used contains only a small amount of halogen (0.05W% or less), the devices may be used

without cleaning without any problems. No cleaning is recommended for TX4937.

3.5.6

Mounting tape carrier packages (TCPs)

(1) When tape carrier packages (TCPs) are mounted, measures must be taken to prevent electrostatic

breakdown of the devices.

(2) If devices are being picked up from tape, or outer lead bonding (OLB) mounting is being carried out,

consult the manufacturer of the insertion machine which is being used, in order to establish the optimum

mounting conditions in advance and to avoid any possible hazards.

(3) The base film, which is made of polyimide, is hard and thin. Be careful not to cut or scratch your hands or

any objects while handling the tape.

(4) When punching tape, try not to scatter broken pieces of tape too much.

(5) Treat the extra film, reels and spacers left after punching as industrial waste, taking care not to destroy or

pollute the environment.

(6) Chips housed in tape carrier packages (TCPs) are bare chips and therefore have their reverse side exposed.

To ensure that the chip will not be cracked during mounting, ensure that no mechanical shock is applied to

the reverse side of the chip. Electrical contact may also cause a chip to fail. Therefore, when mounting

devices, make sure that nothing comes into electrical contact with the reverse side of the chip.

If your design requires connecting the reverse side of the chip to the circuit board, please consult Toshiba or

a Toshiba distributor beforehand.

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