TMPR4937 datasheet(35/552 Pages) TOSHIBA

35 / 552 page

3 General Safety Precautions and Usage Considerations

3-13

3.5.3

Soldering temperature profile

The soldering temperature and heating time vary from device to device. Therefore, when specifying the

mounting conditions, refer to the individual datasheets and databooks for the devices used.

(1) Using medium infrared ray reflow

• Heating top and bottom with long or medium infrared rays is recommended (see Figure 3).

Long infrared ray heater (preheating)

Medium infrared ray heater

(reflow)

Product flow

Figure 3 Heating top and bottom with long or medium infrared rays

• Complete the infrared ray reflow process for 30 to 50 seconds at a package surface temperature of between

230°C and 260°C.

• Refer to Figure 4 for an example of a good temperature profile for infrared or hot air reflow.

230

30-50 s

Time (s)

60-120 s

(°C)

260

190

180

Figure 4 Sample temperature profile (Pb free) for infrared or hot air reflow

(2) Using hot air reflow

• Complete hot air reflow for 30 to 50 seconds at a package surface temperature of between 230°C and 260°C.

• For an example of a recommended temperature profile, refer to Figure 4 above.

3.5.4

Flux cleaning and ultrasonic cleaning

(1) When cleaning circuit boards to remove flux, make sure that no residual reactive ions such as Na or Cl

remain. Note that organic solvents react with water to generate hydrogen chloride and other corrosive gases

which can degrade device performance.

(2) Washing devices with water will not cause any problems. However, make sure that no reactive ions such as

sodium and chlorine are left as a residue. Also, be sure to dry devices sufficiently after washing.

TMPR4937 датащи(PDF) 35 Page - Toshiba Semiconductor