LPC55S2X datasheet(4/132 Pages) NXP

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NXP Semiconductors

LPC55S2x/LPC552x

32-bit Arm Cortex®-M33 microcontroller

– Each crystal oscillator has one embedded capacitor bank which can be used as an integrated load

capacitor. Using APIs, the capacitor banks on each crystal pin can tune the frequency for crystals with a

Capacitive Load (CL) which conserves board space and reduces costs.

• Power-saving modes and wake-up:

– Integrated PMU (Power Management Unit) to minimize power consumption.

– Reduced power modes: Sleep, deep-sleep with RAM retention, power-down with RAM retention and CPU

retention, and deep power-down with RAM retention.

– Configurable wake-up options from peripherals interrupts.

– The Micro-Tick Timer running from the watchdog oscillator, and the Real-Time Clock (RTC) running from the

32.768 kHz clock, can be used to wake-up the device from sleep and deep-sleep modes.

– Power-On Reset (POR, around 0.8 V).

– Brown-Out Detectors (BOD) for VBAT_DCDC for forced reset or interrupt.

• Operating from internal DC-DC converter.

• Single power supply 1.8 V to 3.6 V.

• JTAG boundary scan supported.

• Operating temperature range -40 °C to +105 °C.

• Available in HLQFP100, HTQFP64, VFBGA98, and VFBGA59 packages.

3 Ordering information

Package

Type number

Name

Description

Version

LPC55S28JBD100 HLQFP100 plastic low profile quad flat package; 100 leads; body 14 × 14 × 0.5mm pitch SOT1570-3

LPC55S26JBD100 HLQFP100 plastic low profile quad flat package; 100 leads; body 14 × 14 × 0.5mm pitch SOT1570-3

LPC55S28JEV98 VFBGA98 thin fine-pitch ball grid array package; 98 balls; body 7‘ 7‘ 0.5 mm

SOT1982-1

LPC55S26JEV98 VFBGA98 thin fine-pitch ball grid array package; 98 balls; body 7‘ 7‘ 0.5 mm

SOT1982-1

LPC55S28JBD64 HTQFP64 thin fine-pitch ball grid array package; 64 leads; body 10 × 10 × 0.5mm pitch SOT855-5

LPC55S26JBD64 HTQFP64 thin fine-pitch ball grid array package; 64 leads; body 10 × 10 × 0.5mm pitch SOT855-5

LPC5528JBD100

HLQFP100 plastic low profile quad flat package; 100 leads; body 14 × 14 × 0.5mm pitch SOT1570-3

LPC5526JBD100

HLQFP100 plastic low profile quad flat package; 100 leads; body 14 × 14 × 0.5mm pitch SOT1570-3

LPC5528JEV98

VFBGA98 thin fine-pitch ball grid array package; 98 balls; body 7‘ 7‘ 0.5 mm

SOT1982-1

LPC5526JEV98

VFBGA98 thin fine-pitch ball grid array package; 98 balls; body 7‘ 7‘ 0.5 mm

SOT1982-1

LPC5528JBD64

HTQFP64 plastic low profile quad flat package; 64 leads; body 10 x10 x 0.5mm pitch

SOT855-5

LPC5526JBD64

HTQFP64 plastic low profile quad flat package; 64 leads; body 10 x10 x 0.5mm pitch

SOT855-5

LPC55S28JEV59 VFBGA59 thin fine-pitch ball grid array package; 59 balls; body 4 x 4 x 0.4 mm pitch

SOT2162-1

LPC5528JEV59

VFBGA59 thin fine-pitch ball grid array package; 59 balls; body 4 x 4 x 0.4 mm pitch

SOT2162-1

Table 1. Ordering information

LPC55S2X_LPC552X

All information provided in this document is subject to legal disclaimers.

Data sheet

Rev. 2.3 — 29 August 2024

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