AM62A7 datasheet(7/238 Pages) TI1

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4 Revision History

Changes from March 15, 2023 to August 4, 2023 (from Revision * (MARCH 2023) to Revision A

(AUGUST 2023))

Page

• Global: Changed the document product status from "Advance Information" to "Production Data"................... 1

• (Features): Included Multi-Media Card (MMC) in the first bullet describing MMC/SD features .........................1

• (Features): Added Serial NAND Flash to the list of Boot Options...................................................................... 1

• (Package Information): Updated the table to match the new content standard and added automotive "-Q1"

devices................................................................................................................................................................4

• (Functional Block Diagram): Removed "DDR4" from the "DDR4/LPDDR4 with inline EEC (32b)" block under

the System Memory area................................................................................................................................... 5

• (Functional Block Diagram): Added the Software Build Sheet note................................................................... 5

• (Device Comparison): Added the Processor-SDK-AM62Ax URL to the Software Build Sheet note.................. 9

• (Device Comparison): Corrected the name of the JTAG User ID register and added the register bit values by

device "Features" code.......................................................................................................................................9

• (Device Comparison): Changed "TBD" to "Yes" for Full CAN-FD Support......................................................... 9

• (Device Comparison): Changed General-Purpose Memory Controller (GPMC) address range from 1GB to

128MB................................................................................................................................................................ 9

• (Related Products): Additional content was added to the Related Products section........................................10

• (MMC0 Signal Descriptions): Removed the note associated with MMC0_CLK............................................... 64

• (MMC1 Signal Descriptions): Removed the note associated with MMC1_CLK............................................... 65

• (MMC2 Signal Descriptions): Changed the note associated with MMC2_CLK................................................ 65

• (Pin Connectivity Requirements): Updated the requirement for VMON_3P3_SOC to include another

connectivity option............................................................................................................................................ 73

• (Pin Connectivity Requirements): Updated the second paragraph of the note following the Connectivity

Requirements table. The update clarifies the operation of configurable device IOs and includes precautions

that must be taken to prevent floating signals from damaging device input buffers......................................... 73

• (Power-On Hours): Removed commercial temperature range since it doesn't apply....................................... 79

• (Recommended Operating Conditions): Updated the notes associated with VDD_CANUART and

VDDSHV_CANUART to clarify the requirements for these power rails............................................................80

• (Power Consumption Summary): Added new section that references Power Estimation Tool application

note...................................................................................................................................................................83

• (DDR Electrical Characteristics): Added a reference to the JEDEC standard..................................................88

• (Power-Up Sequencing): Added Power-Up Sequencing – Supply / Signal Assignments table with waveform

references and notes. Added a new waveform for VDD_CANUART to show its sequence requirements

relative to VDD_CORE when powered from a separate always on power source........................................... 94

• (Power-Down Sequencing): Added Power-Down Sequencing – Supply / Signal Assignments table with

waveform references and notes. Added a new waveform for VDD_CANUART to show its sequence

requirements relative to VDD_CORE when powered from a separate always on power source..................... 97

• (Partial IO Power Sequencing): Changed the section title to "Partial IO Power Sequencing" and included a

description of sequencing requirements for entry into and exit from Partial IO low power mode..................... 99

• (Reset Timing Conditions): Changed the Input slew rate minimum values for VDD = 1.8V and VDD = 3.3V

(original values were swapped)...................................................................................................................... 100

• (MCU_RESETSTATz, and RESETSTATz Switching Characteristics): Changed the minimum value of

parameter RST13 from "0" to "960"................................................................................................................100

• (MCU_OSC0 Switching Characteristics - Crystal Mode): Defined values for all previously undefined TBD

values............................................................................................................................................................. 109

• (LFXOSC Modes of Operation): Changed the value of PD_C for BYPASS mode from "X" to "0"..................113

• (CPSW3G MDIO Timing): Changed the minimum setup time value (parameter MDIO1) from "90" to "45". Also

changed the minimum and maximum output delay time values (parameter MDIO7) from "-150" and "150" to

"-10" and "10" respectively..............................................................................................................................118

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AM62A7, AM62A7-Q1, AM62A3, AM62A3-Q1

SPRSP77A – MARCH 2023 – REVISED AUGUST 2023

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